The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.

A processing fluid contains a metal ion and an organopolysiloxane, wherein the content of the metal ion in the processing fluid is from 0.5 to 50 g/L and the organopolysiloxane has a weight average molecular of from 5,000 to 500,000.

A processing fluid contains a metal ion and an organopolysiloxane, wherein the content of the metal ion in the processing fluid is from 0.5 to 50 g/L and the organopolysiloxane has a weight average molecular of from 5,000 to 500,000.

Ligand-capped scattering nanoparticles, curable ink compositions containing the ligand-capped scattering nanoparticles, and methods of forming films from the ink compositions are provided. Also provided are cured films formed by curing the ink compositions and photonic devices incorporating the films. The ligands bound to the inorganic scattering nanoparticles include a head group and a tail group. The head group includes a polyamine chain and binds the ligands to the nanoparticle surface. The tail group includes a polyalkylene oxide chain.

An ink contains water, a pigment, and a polymer having a structure unit represented by the following Chemical structure 1, ##STR00001## where R.sub.1 represents an organic group having at least carbon and oxygen.

Printed matter includes a substrate comprising a vinyl chloride resin and a printing layer on the substrate, wherein the surface of the substrate has a static friction coefficient of from 0.04 to 0.06 and a dynamic friction coefficient of from 0.02 to 0.03 when the surface of the substrate is rubbed with standard adjacent fabrics for staining for color fastness test under a load of 200 g, wherein the surface of the printing layer has a static friction coefficient of from 0.35 to 0.50 and a dynamic friction coefficient of from 0.20 to 0.30 when the surface of the printing layer is rubbed with standard adjacent fabrics for staining for color fastness test under a load of 200 g.

An aqueous polymeric particle dispersion, the particle comprises a polymer and a Si—O-containing moiety, the Si—O-containing moiety is linked to the polymer. The polymeric particle dispersion can be incorporated in aqueous printing liquids such as aqueous inkjet inks.

An aqueous polymeric particle dispersion, the particle comprises a polymer and a Si—O-containing moiety, the Si—O-containing moiety is linked to the polymer. The polymeric particle dispersion can be incorporated in aqueous printing liquids such as aqueous inkjet inks.

A three-dimensional printing kit can include a polymeric build material including thermoplastic elastomeric particles having a D50 particle size from about 2 μm to about 150 μm, and a fusing agent. The fusing agent can include water, from about 5 wt % to about 40 wt % lower alkyldiol organic co-solvent, and a radiation absorber to generate heat from absorbed electromagnetic radiation.

A three-dimensional printing kit can include a polymeric build material including thermoplastic elastomeric particles having a D50 particle size from about 2 μm to about 150 μm, and a fusing agent. The fusing agent can include water, from about 5 wt % to about 40 wt % lower alkyldiol organic co-solvent, and a radiation absorber to generate heat from absorbed electromagnetic radiation.