Patent classifications
C09D11/102
SUPPORT INK COMPOSITIONS AND METHODS OF USE THEREOF IN ADDITIVE MANUFACTURING SYSTEMS
The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.
Method of applying a coating composition to a substrate
A system for applying a coating composition is provided herein. The system includes a first high transfer efficiency applicator defining a first nozzle orifice and a second high transfer efficiency applicator defining a second nozzle orifice. The system further includes a reservoir. The system further includes a substrate defining a first target area and a second target area. The first high transfer efficiency applicator and the second high transfer efficiency applicator are configured to receive the coating composition from the reservoir and configured to expel the coating composition through the first nozzle orifice to the first target area of the substrate and to expel the coating composition through the second nozzle orifice to the second target area of the substrate.
Method of applying a coating composition to a substrate
A system for applying a coating composition is provided herein. The system includes a first high transfer efficiency applicator defining a first nozzle orifice and a second high transfer efficiency applicator defining a second nozzle orifice. The system further includes a reservoir. The system further includes a substrate defining a first target area and a second target area. The first high transfer efficiency applicator and the second high transfer efficiency applicator are configured to receive the coating composition from the reservoir and configured to expel the coating composition through the first nozzle orifice to the first target area of the substrate and to expel the coating composition through the second nozzle orifice to the second target area of the substrate.
Powder of spherical crosslinkable polyamide particles, preparation process and use with the selective laser sintering technique
The present invention provides a powder of spherical particles of crosslinkable polyamide suitable for the technique of selective laser sintering (SLS), and also a process for the production of such a powder of spherical particles of crosslinkable polyamide. The present invention also provides the production of articles by SLS, followed by a crosslinking step, starting from said powder of spherical particles of crosslinkable polyamide.
Powder of spherical crosslinkable polyamide particles, preparation process and use with the selective laser sintering technique
The present invention provides a powder of spherical particles of crosslinkable polyamide suitable for the technique of selective laser sintering (SLS), and also a process for the production of such a powder of spherical particles of crosslinkable polyamide. The present invention also provides the production of articles by SLS, followed by a crosslinking step, starting from said powder of spherical particles of crosslinkable polyamide.
3D printing build materials and support materials comprising a phosphor
In one aspect, build materials and support materials for use with a 3D printer are described herein. Such materials include a phosphor component in combination with other components. In some embodiments, the phosphor component of a build material or support material is present in the material in an amount of 0.001-0.5 wt. % and has a peak photoluminescence (PL) emission wavelength of 430-750 nm and a photoluminescence quantum yield (QY) of 0.10-1.
THREE-DIMENSIONAL PRINTING WITH THERMOCHROMIC ADDITIVES
A three-dimensional printing kit can include a powder bed material and a fusing agent to selectively apply to the powder bed material. The powder bed material can include polymer particles and a thermochromic additive. The thermochromic additive can be chemically stable at a melting point temperature of the polymer particles, and the thermochromic additive can exhibit a color change at a color transition temperature that is below the melting point of the polymer particles. The fusing agent can include water and a radiation absorber to absorb radiation energy and convert the radiation energy to heat.
THREE-DIMENSIONAL PRINTING WITH THERMOCHROMIC ADDITIVES
A three-dimensional printing kit can include a powder bed material and a fusing agent to selectively apply to the powder bed material. The powder bed material can include polymer particles and a thermochromic additive. The thermochromic additive can be chemically stable at a melting point temperature of the polymer particles, and the thermochromic additive can exhibit a color change at a color transition temperature that is below the melting point of the polymer particles. The fusing agent can include water and a radiation absorber to absorb radiation energy and convert the radiation energy to heat.
THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE TEMPERATURE COEFFICIENT INK
An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius.
THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE TEMPERATURE COEFFICIENT INK
An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius.