Patent classifications
C09D11/102
POLYURETHANE RESIN, NON-NATURAL LEATHER, AND INK
A polyurethane resin includes a reaction product of a raw material component containing a polyisocyanate, a macropolyol, a hydrophilic group-containing polyol, and a chain extender. The polyisocyanate is an alicyclic polyisocyanate. The macropolyol contains a plant-derived macropolyol. A biomass degree of the reaction product is 30% or more.
POLYURETHANE RESIN, NON-NATURAL LEATHER, AND INK
A polyurethane resin includes a reaction product of a raw material component containing a polyisocyanate, a macropolyol, a hydrophilic group-containing polyol, and a chain extender. The polyisocyanate is an alicyclic polyisocyanate. The macropolyol contains a plant-derived macropolyol. A biomass degree of the reaction product is 30% or more.
AQUEOUS RESIN CROSSLINKING AGENT, AQUEOUS RESIN CROSSLINKING AGENT-CONTAINING LIQUID, AQUEOUS RESIN COMPOSITION, CURED FILM AND ARTICLE
Provided is a waterborne resin crosslinking agent and the like capable of inhibiting lowering of gloss (relative specular glossiness) of cured films (waterborne resin coating films) after heating. The waterborne resin crosslinking agent includes a polycarbodiimide compound (A) and a polycarbodiimide compound (B); the polycarbodiimide compound (A) has a structure in which isocyanate groups at both terminals are each capped with a hydrophilic organic compound, and at least one of the hydrophilic organic compounds has a molecular weight of 340 or more; the polycarbodiimide compound (B) has a structure in which isocyanate groups at both terminals are each capped with a monool compound having 3 to 18 carbon atoms; when the monool compound has 3 to 17 carbon atoms, the polycarbodiimide compound (A) is in an amount of 5 to 95 parts by mass per 100 parts by mass in total of the polycarbodiimide compound (A) and the polycarbodiimide compound (B); and when the monool compound has 18 carbon atoms, the polycarbodiimide compound (A) is in an amount of 30 to 70 parts by mass per 100 parts by mass in total of the polycarbodiimide compound (A) and the polycarbodiimide compound (B).
AQUEOUS RESIN CROSSLINKING AGENT, AQUEOUS RESIN CROSSLINKING AGENT-CONTAINING LIQUID, AQUEOUS RESIN COMPOSITION, CURED FILM AND ARTICLE
Provided is a waterborne resin crosslinking agent and the like capable of inhibiting lowering of gloss (relative specular glossiness) of cured films (waterborne resin coating films) after heating. The waterborne resin crosslinking agent includes a polycarbodiimide compound (A) and a polycarbodiimide compound (B); the polycarbodiimide compound (A) has a structure in which isocyanate groups at both terminals are each capped with a hydrophilic organic compound, and at least one of the hydrophilic organic compounds has a molecular weight of 340 or more; the polycarbodiimide compound (B) has a structure in which isocyanate groups at both terminals are each capped with a monool compound having 3 to 18 carbon atoms; when the monool compound has 3 to 17 carbon atoms, the polycarbodiimide compound (A) is in an amount of 5 to 95 parts by mass per 100 parts by mass in total of the polycarbodiimide compound (A) and the polycarbodiimide compound (B); and when the monool compound has 18 carbon atoms, the polycarbodiimide compound (A) is in an amount of 30 to 70 parts by mass per 100 parts by mass in total of the polycarbodiimide compound (A) and the polycarbodiimide compound (B).
AQUEOUS RESIN CROSSLINKING AGENT, AQUEOUS RESIN CROSSLINKING AGENT-CONTAINING LIQUID, AND AQUEOUS RESIN COMPOSITION
A waterborne resin crosslinking agent is provided, wherein the waterborne resin crosslinking agent of the present invention includes a polycarbodiimide compound (A) and a polycarbodiimide compound (B); the polycarbodiimide compound (A) has a structure in which the isocyanate groups at both terminals are each capped with a predetermined hydrophilic organic compound; the polycarbodiimide compound (B) has a chain diisocyanate compound as a structural unit, and has a structure in which the isocyanate groups at both terminals are each capped with a predetermined organic compound, and the polycarbodiimide compound (A) is in an amount of 5 to 90 parts by mass per 100 parts by mass in total of the polycarbodiimide compounds (A) and (B).
AQUEOUS RESIN CROSSLINKING AGENT, AQUEOUS RESIN CROSSLINKING AGENT-CONTAINING LIQUID, AND AQUEOUS RESIN COMPOSITION
A waterborne resin crosslinking agent is provided, wherein the waterborne resin crosslinking agent of the present invention includes a polycarbodiimide compound (A) and a polycarbodiimide compound (B); the polycarbodiimide compound (A) has a structure in which the isocyanate groups at both terminals are each capped with a predetermined hydrophilic organic compound; the polycarbodiimide compound (B) has a chain diisocyanate compound as a structural unit, and has a structure in which the isocyanate groups at both terminals are each capped with a predetermined organic compound, and the polycarbodiimide compound (A) is in an amount of 5 to 90 parts by mass per 100 parts by mass in total of the polycarbodiimide compounds (A) and (B).
PIEZORESISTIVE COMPOSITES VIA ADDITIVE MANUFACTURING AND COMPOSITE FILAMENTS ASSOCIATED THEREWITH
Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a component present therein. Composite filaments suitable for additive manufacturing may comprise a continuous polymer phase of a first thermoplastic polymer and a second thermoplastic polymer that are immiscible with one another, and electrically conductive particles distributed in the continuous polymer phase, such as microparticles, nanoparticles, or any combination thereof. The first thermoplastic polymer is dissolvable or degradable and the second thermoplastic polymer is insoluble or non-degradable under specified conditions. Removal of the first thermoplastic polymer from a printed part may introduce porosity thereto, thereby inducing or enhancing piezoresistivity within the printed part. An aqueous mixture comprising the electrically conductive particles and the first and second thermoplastic polymers may have water removed therefrom, and the resulting composite residue may be extruded to form the composite filaments.
PIEZORESISTIVE COMPOSITES VIA ADDITIVE MANUFACTURING AND COMPOSITE FILAMENTS ASSOCIATED THEREWITH
Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a component present therein. Composite filaments suitable for additive manufacturing may comprise a continuous polymer phase of a first thermoplastic polymer and a second thermoplastic polymer that are immiscible with one another, and electrically conductive particles distributed in the continuous polymer phase, such as microparticles, nanoparticles, or any combination thereof. The first thermoplastic polymer is dissolvable or degradable and the second thermoplastic polymer is insoluble or non-degradable under specified conditions. Removal of the first thermoplastic polymer from a printed part may introduce porosity thereto, thereby inducing or enhancing piezoresistivity within the printed part. An aqueous mixture comprising the electrically conductive particles and the first and second thermoplastic polymers may have water removed therefrom, and the resulting composite residue may be extruded to form the composite filaments.
Reaction Solution For Pigment Printing, Ink Set, And Recording Method
A reaction solution for pigment printing according to an embodiment of the present disclosure contains a polyvalent metal salt, a cationic polymer, a polyhydric alcohol having a standard boiling point of 250° C. or higher, and water, and is used by being ejected by an ink jet method.
STRETCHABLE ELECTRICALLY CONDUCTIVE INK COMPOSITIONS
Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.