An ink set containing an inkjet ink and a treatment liquid, wherein the inkjet ink contains a pigment, a water-soluble organic solvent, a surfactant and water, the water-soluble organic solvent contains an alkyl diol (A) of 2 to 8 carbon atoms, the weighted average boiling point of the water-soluble organic solvent at one atmosphere is from 175 to 240° C., the surfactant contains an acetylenediol-based surfactant, the treatment liquid contains a coagulant, calcium nitrate is included as the coagulant in an amount of 6.8 to 20.8% by mass relative to the total mass of the treatment liquid, and the pH of the treatment liquid is from 2 to 11.

An ink set containing an inkjet ink and a treatment liquid, wherein the inkjet ink contains a pigment, a water-soluble organic solvent, a surfactant and water, the water-soluble organic solvent contains an alkyl diol (A) of 2 to 8 carbon atoms, the weighted average boiling point of the water-soluble organic solvent at one atmosphere is from 175 to 240° C., the surfactant contains an acetylenediol-based surfactant, the treatment liquid contains a coagulant, calcium nitrate is included as the coagulant in an amount of 6.8 to 20.8% by mass relative to the total mass of the treatment liquid, and the pH of the treatment liquid is from 2 to 11.

A composition for forming a patterned thin metal film on a substrate is presented. The composition includes metal cations; and at least one solvent, wherein the patterned thin metal film is adhered to a surface of the substrate upon exposure of the at least metal cations to a low-energy plasma.

A composition for forming a patterned thin metal film on a substrate is presented. The composition includes metal cations; and at least one solvent, wherein the patterned thin metal film is adhered to a surface of the substrate upon exposure of the at least metal cations to a low-energy plasma.

A system for applying a coating composition is provided herein. The system includes a first high transfer efficiency applicator defining a first nozzle orifice and a second high transfer efficiency applicator defining a second nozzle orifice. The system further includes a reservoir. The system further includes a substrate defining a first target area and a second target area. The first high transfer efficiency applicator and the second high transfer efficiency applicator are configured to receive the coating composition from the reservoir and configured to expel the coating composition through the first nozzle orifice to the first target area of the substrate and to expel the coating composition through the second nozzle orifice to the second target area of the substrate.

A system for applying a coating composition is provided herein. The system includes a first high transfer efficiency applicator defining a first nozzle orifice and a second high transfer efficiency applicator defining a second nozzle orifice. The system further includes a reservoir. The system further includes a substrate defining a first target area and a second target area. The first high transfer efficiency applicator and the second high transfer efficiency applicator are configured to receive the coating composition from the reservoir and configured to expel the coating composition through the first nozzle orifice to the first target area of the substrate and to expel the coating composition through the second nozzle orifice to the second target area of the substrate.

An ink composition set has at least a solvent-based orange ink composition containing an orange pigment as a pigment and a solvent and a solvent-based red ink composition containing a red pigment as a pigment and a solvent.

An ink composition set has at least a solvent-based orange ink composition containing an orange pigment as a pigment and a solvent and a solvent-based red ink composition containing a red pigment as a pigment and a solvent.

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.