The present disclosure is drawn to polyurethane dispersions. In one example, a polyurethane dispersion can include a polyurethane with a polymeric ionic side chain and a polymeric non-ionic side chain. The polyurethane can be formed of polymerized monomers including a diisocyanate, a first polymeric diol, and a second polymeric diol. The first polymeric diol can include a first polymer chain replacing a hydrogen atom of a thiol group of a 1-thioglycerol molecule. The first polymer chain can include a block of a polymerized ionic group-containing vinyl monomer. The second polymeric diol can include a second polymer chain replacing a hydrogen atom of a thiol group of a 1-thioglycerol molecule. The second polymer chain can include a block of a polymerized non-ionic vinyl monomer, and the second polymer chain can be devoid of ionic groups.

An apparatus with integrated optical waveguides. The apparatus has: a plurality of layers, wherein a conductive pathway is patterned on a surface of at least one of the plurality of layers. The plurality of layers are laminated together. A plurality of nanocomposite-inks, each with a nanofiller dispersed in an organic matrix have optical dispersion different from the other plurality of nanocomposite-ink, form the optical waveguides. The optical waveguides are formed on the surface of, or within, at least one of the plurality of layers.

An apparatus with integrated optical waveguides. The apparatus has: a plurality of layers, wherein a conductive pathway is patterned on a surface of at least one of the plurality of layers. The plurality of layers are laminated together. A plurality of nanocomposite-inks, each with a nanofiller dispersed in an organic matrix have optical dispersion different from the other plurality of nanocomposite-ink, form the optical waveguides. The optical waveguides are formed on the surface of, or within, at least one of the plurality of layers.

A primer for inkjet printing includes one or more aqueous resin(s) and hydrophobic particles having a particle size of 0.05 μm to 15 μm and a melting point of 80° C. to 100° C. The primer improves abrasive resistance properties of an inkjet ink printed on a printed material.

A primer for inkjet printing includes one or more aqueous resin(s) and hydrophobic particles having a particle size of 0.05 μm to 15 μm and a melting point of 80° C. to 100° C. The primer improves abrasive resistance properties of an inkjet ink printed on a printed material.

The present application relates to an ink formulation, and preparation methods of functional layer of optoelectronic devices. The ink formulation includes a component A and a component B, the component A including a first liquid, the component B including a second liquid and a functional material dispersed in the second liquid, the first liquid having a boiling point at least 10° C. higher than a boiling point of the second liquid; the first liquid and the second liquid are immiscible and the solubility of the functional material in the second liquid is ≥1 g, the solubility of the functional material in the first liquid is ≤0.05 g, the density of the first liquid is greater than the density of the second liquid, and the ratio of the surface tension of the first liquid to the surface tension of the second liquid ranges from 0.8 to 1.2.

A method of manufacturing a semiconductor package which is at least in part covered by an electromagnetic interference shielding layer. The method includes at least these steps: i. providing the semiconductor package and an ink composition having at least a compound comprising at least one metal precursor and at least one organic compound; ii. applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; and iii. treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm. Further disclosed is a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. Still further disclosed are a semiconductor package comprising an electromagnetic interference shielding layer having a specific conductance and thickness, and uses of an ink composition.

A method of manufacturing a semiconductor package which is at least in part covered by an electromagnetic interference shielding layer. The method includes at least these steps: i. providing the semiconductor package and an ink composition having at least a compound comprising at least one metal precursor and at least one organic compound; ii. applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; and iii. treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm. Further disclosed is a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. Still further disclosed are a semiconductor package comprising an electromagnetic interference shielding layer having a specific conductance and thickness, and uses of an ink composition.

Described herein are methods for printing conductive ink on a substrate. In one embodiment, the method for printing a conductive ink on a substrate, comprises (a) printing, using a printer, one or more layers of a non-conductive material on a surface of the substrate such that one or more channels are formed to produce a template on the surface of the substrate; and (b) printing one or more layers of the conductive ink within the one or more channels In another embodiment, substrates produced by the methods described herein are provided. In another embodiment, systems for implementing the procedures described herein are provided.

The present disclosure provides an ink, an ink manufacturing method, and a display device. The ink includes the first solution, the second solution, the third solution, the fourth solution, and the blank ink. The ink is mixed from the fourth solution and the blank solution. The mass percentage of the CsPbX3 in the fourth solution is 5% to 30% to the fourth solution and the blank ink.