Patent classifications
C09D133/062
SOLVENT-FREE FORMULATIONS AND NANOCOMPOSITES
The present disclosure provides a high-refractive index acrylic formulation embedded with sub-30 nm metal oxide nanocrystals. The formulation is solvent-free, low-viscosity, inkjettable (among other film deposition techniques) and produces high-refractive index, high transparency nanocomposites for a variety of optical applications including OLED lighting and display applications
WEAK COVALENT CROSSLINKS IN THERMOSET MATERIALS FOR INCREASED TOUGHNESS
This disclosure provides polymeric materials comprising weak crosslinking covalent bonds and/or weak crosslinking units comprising a weak covalent bond. Weak covalent bonds can be used in place of hydrogen bonds present in traditional polymeric materials (e.g., polyurethanes). Advantageously, the toughness can be controlled by varying the strength of weak covalent bonds and/or by varying the number of weak covalent crosslinks. Crosslinked materials applying the weak covalent crosslinking bonds can be used to create tough materials able to resist stress relaxation. Further, the present disclosure provides polymer chains and polymeric materials comprising inchain loops (also referred to herein as rings). The inchain loops comprise weak bonds and/or weak bridges comprising at least one weak bond. This disclosure also provides compositions comprising the polymer chains, materials comprising the polymer chains, monomer units that can react to form inchain loop-comprising polymer chains, resins comprising the monomer units, and related materials, appliances, and uses.
Photocurable composition for three-dimensional molding, three-dimensional molded product, and method for producing three-dimensional molded product
A photocurable composition for three-dimensional modeling capable of high-speed modeling, a three-dimensional modeled object using the composition, and a method for producing the three-dimensional modeled object is provided. A photocurable composition for three-dimensional modeling, comprising a polymerizable organic compound component is provided. The photocurable composition has a steady flow viscosity of 30,000 mPa s or less measured with a rotary rheometer at 25° C. and a shear rate of 0.01 per second. When the photocurable composition for three-dimensional modeling is irradiated with a light having a light intensity of 1.3 mW/cm2, G′ becomes 1×10.sup.6 Pa or more after a start of photopolymerization in an integrated light irradiation time of 4 seconds or less. After the start of photopolymerization, a maximum value of tan δ on and after a gel point is 0.5 or more. The gel point is the point where G′=G″ is satisfied for the first time after the start of photopolymerization. G′ is a storage shear modulus, G′ is loss shear modulus, and tan δ is a loss tangent, each of which is calculated based on measurement data for 30 seconds per one measurement, measured with a rotary rheometer having a pair of parallel plate with a diameter of 10 mm and a measurement gap of 0.1 mm at a strain of 0.5% or less, a frequency of 0.1 Hz, and 25° C.
Recyclable Composition for Paper Coating
Disclosed herein is a composition that can provide moisture barrier during packaging. Additionally disclosed herein is a substrate coated with the composition that is recyclable and repulpable. The composition includes at least one ester and at least one styrene acrylic copolymer with a glass transition temperature in the range of from -54° C. to 10° C.
Resist composition and method of forming resist pattern
A resist composition containing a resin component (A1) having a constitutional unit derived from a compound represented by General Formula (a01-1). In the formula, W.sup.01 represents a polymerizable group-containing group, C.sup.t represents a tertiary carbon atom, and X.sup.t represents a group that forms a monocyclic or polycyclic alicyclic group together with C.sup.t, Ra.sup.1 to Ra.sup.3 represents a hydrocarbon group having 1 to 10 carbon atoms, which may have a substituent, or a hydrogen atom, or two or more of Ra.sup.1 to Ra.sup.3 are bonded to each other to form an aliphatic ring, not all of Ra.sup.1 to Ra.sup.3 are hydrogen atoms, n represents 0 or 1 ##STR00001##
Polymer for pattern forming material
A pattern forming material is configured to use for forming an organic film on a film to be processed, patterning the organic film, and then forming a composite film by infiltrating a metallic compound into the patterned organic film. The pattern forming material contains a polymer including a monomer unit represented by a general formula (1) described below, ##STR00001##
wherein, R.sup.5 is a hydrogen atom or a methyl group, each R.sup.6 independently is an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, or an s-butyl group, and a monomer unit derived from a compound represented by a general formula (2) described below, ##STR00002##
wherein, R.sup.11 is a hydrogen atom or a methyl group, each R.sup.12 independently is a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, or a t-butyl group.
Organic polymer particles containing poly(oxazoline) stabilizers and use of poly(oxazolines) for stabilizing organic polymer particles
The invention relates to compositions containing water-soluble poly(oxazoline) and organic polymer particles chosen from the group of polyolefins, polyvinyl aromatics, polyvinyl esters, polyesters, polyamides, polyimides, polycarboxylic acids, polycarboxilic acid esters, polycarboxylic acid amides, polynitriles, polysulfonic acids, polyketones, polysulfones, polymeric polyols, polyurethanes, proteins, polymeric carbohydrates, nucleic acids or from a mixture of two or more of these polymers. The water-soluble poly(oxazolin) acts as a stabilizer for the polymer particles and can particularly advantageously be used as a stabilizer in the freeze-drying of aqueous polymer dispersions.
Composite heat insulation system
The invention relates to a composite heat insulation system, comprising an insulating layer, optionally a reinforcing layer, which is applied to the insulating layer, and a cover layer, which is applied to the insulating layer or, if present, to the reinforcing layer, characterized in that the cover layer contains composite particles, wherein the composite particles contain at least one organic polymer and at least one inorganic solid, wherein the weight percentage of inorganic solid is 15 to 40 wt %, with respect to the total weight of organic polymer and inorganic solid in the composite particle.
RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME
A resin composition of an embodiment includes a (meth)acrylate monomer, a photoinitiator, and a moisture absorbent, wherein the moisture absorbent includes a hydrolysable group, and a carboxyl group after hydrolysis, thereby providing a display device with improved tolerance to moisture and moisture permeability.
RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME
A resin composition of an embodiment includes a (meth)acrylate monomer, a photoinitiator, and a moisture absorbent, wherein the moisture absorbent includes a hydrolysable group, and a carboxyl group after hydrolysis, thereby providing a display device with improved tolerance to moisture and moisture permeability.