A method of coating a structure is disclosed. Method steps include providing a structure having a first portion of a first material having a first surface and providing a second portion of a second material having a second surface, wherein a mask is provided over the first surface. Another step includes exposing the mask and the second surface to a solution comprising a polymer and a solvent, wherein the solution dewets from the mask and the polymer collects onto the second surface to form a polymer coating over the second surface without forming a polymer coating on the first surface.

A conductive polymer composition containing: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by the following general formula (2); H.sub.2O (D) for dispersing the composite; and a water-soluble organic solvent (C). This provides a composition which has favorable filterability and film formability, and which is capable of relieving acidity and forming a conductive film with high transparency. Moreover, since the H.sub.2O dispersion of the conductive polymer compound is mixed with an organic solvent, the surface tension and the contact angle are so low that leveling property on a substrate is imparted. The composition is usable in droplet-coating methods. Since an organic solvent having a higher boiling point than H.sub.2O is used as the organic solvent, the composition can avoid solid content precipitation around a nozzle and solid content precipitation due to drying between ejecting the liquid material from a nozzle tip and landing on a substrate.

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A conductive polymer composition containing: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by the following general formula (2); H.sub.2O (D) for dispersing the composite; and a water-soluble organic solvent (C). This provides a composition which has favorable filterability and film formability, and which is capable of relieving acidity and forming a conductive film with high transparency. Moreover, since the H.sub.2O dispersion of the conductive polymer compound is mixed with an organic solvent, the surface tension and the contact angle are so low that leveling property on a substrate is imparted. The composition is usable in droplet-coating methods. Since an organic solvent having a higher boiling point than H.sub.2O is used as the organic solvent, the composition can avoid solid content precipitation around a nozzle and solid content precipitation due to drying between ejecting the liquid material from a nozzle tip and landing on a substrate.

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Embodiments may include a coated granule for roofing systems. The coated granule may include an aluminum silicate granule and a coating disposed on the aluminum silicate granule. The coating may include a copolymer and a siloxane-based or a silane-based compound. The copolymer may be a cationic fluorinated (meth)acrylic copolymer. The aluminum silicate granule may have a particle size in a range from 0.2 mm to 2.4 mm. The aluminum silicate granule may have a 65% or greater reflectivity. The coated granule may repel oil and maintain its reflectivity better than with other techniques.

Embodiments may include a coated granule for roofing systems. The coated granule may include an aluminum silicate granule and a coating disposed on the aluminum silicate granule. The coating may include a copolymer and a siloxane-based or a silane-based compound. The copolymer may be a cationic fluorinated (meth)acrylic copolymer. The aluminum silicate granule may have a particle size in a range from 0.2 mm to 2.4 mm. The aluminum silicate granule may have a 65% or greater reflectivity. The coated granule may repel oil and maintain its reflectivity better than with other techniques.

An object is to obtain a composition capable of: forming a uniform film even by spray coating or even when the composition is applied in the form of ink for inkjet printing; and preventing light emission from a portion other than an ITO electrode surface when the film is mounted on an organic EL device and light is emitted from the device. A conductive polymer composition contains: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by a general formula (1); H.sub.2O (D) for dispersing the composite; a water-soluble organic solvent (C); and a compound (E) shown by a general formula (2). The electric conductivity of a film with a thickness of 20 to 200 nm formed from the conductive polymer composition is less than 1.00E-05 S/cm.

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An object is to obtain a composition capable of: forming a uniform film even by spray coating or even when the composition is applied in the form of ink for inkjet printing; and preventing light emission from a portion other than an ITO electrode surface when the film is mounted on an organic EL device and light is emitted from the device. A conductive polymer composition contains: a composite containing a π-conjugated polymer (A) and a polymer (B) shown by a general formula (1); H.sub.2O (D) for dispersing the composite; a water-soluble organic solvent (C); and a compound (E) shown by a general formula (2). The electric conductivity of a film with a thickness of 20 to 200 nm formed from the conductive polymer composition is less than 1.00E-05 S/cm.

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Provided is a polymer that when used as a main chain scission-type positive resist, can sufficiently inhibit resist pattern collapse, can favorably form a clear resist pattern, and can also improve sensitivity. The polymer includes a monomer unit (A) represented by general formula (I), shown below, and a monomer unit (B) represented by general formula (II), shown below. [In formula (I), R.sup.1 is an organic group including not fewer than 5 and not more than 7 fluorine atoms. In formula (II), R.sup.2 is a hydrogen atom, a fluorine atom, an unsubstituted alkyl group, or a fluorine atom-substituted alkyl group, R.sup.3 is a hydrogen atom, an unsubstituted alkyl group, or a fluorine atom-substituted alkyl group, p and q are each an integer of not less than 0 and not more than 5, and p+q=5.] ##STR00001##

A resist composition that generates an acid upon exposure is soluble in a developing solution, and is changed by action of an acid. The resist composition contains a resin component having solubility in a developing solution, which is changed by action of an acid, and has a constitutional unit represented by General Formula (a01-1) and a constitutional unit derived from a compound represented by General Formula (a02-1). In General Formula (a01-1), R represents a hydrogen atom, an alkyl group, or a halogenated alkyl group; Yax.sup.01 represents a single bond or a linking group; Ax represents a sulfonyl group or a sulfoxide group; and Rax.sup.01 represents an alkyl group, an alkoxy group, a halogen atom, or a halogenated alkyl group. In General Formula (a02-1), W represents a polymerizable group-containing group, Wa.sup.x0 represents a cyclic group having an (n.sub.ax0+1)-valent aromaticity, which may have a substituent, Wa.sup.x0 may form a condensed ring with W, and n.sub.ax0 represents an integer of 1 to 3 ##STR00001##

The present disclosure relates to an antifouling coating layer, and in detail, provides a method of manufacturing an antifouling coating layer having excellent antifouling characteristic and durability through quick deposition using iCVD.