A composition for forming a resist underlayer film containing a solvent and polymer comprising a unit structure (A) represented by formula (1) and/or formula (2). The composition is capable of forming a hydrophobic underlayer film that has a high contact angle with pure water and exhibits high adhesion to an upper layer film, thereby being not susceptible to separation therefrom, while meeting the requirement of good coatability, the composition being also capable of exhibiting other good characteristics such as sufficient resistance to a chemical agent that is used for resist underlayer films.

A composition for forming a resist underlayer film containing a solvent and polymer comprising a unit structure (A) represented by formula (1) and/or formula (2). The composition is capable of forming a hydrophobic underlayer film that has a high contact angle with pure water and exhibits high adhesion to an upper layer film, thereby being not susceptible to separation therefrom, while meeting the requirement of good coatability, the composition being also capable of exhibiting other good characteristics such as sufficient resistance to a chemical agent that is used for resist underlayer films.

A coating composition comprising an acid functional acrylic resin and a silane modified compound is disclosed. Substrates coated at least in part with such coatings are also disclosed.

A coating composition comprising an acid functional acrylic resin and a silane modified compound is disclosed. Substrates coated at least in part with such coatings are also disclosed.

A coating composition comprising an acid functional acrylic resin and a silane modified compound is disclosed. Substrates coated at least in part with such coatings are also disclosed.

A coating composition comprising an acid functional acrylic resin and a silane modified compound is disclosed. Substrates coated at least in part with such coatings are also disclosed.

Provided is a dispersion liquid that can improve coatability (wettability) with respect to a base material and can form a conductive film having high close adherence with a base material. The dispersion liquid contains a carbon material (A), a condensate (B) of an aromatic sulfonic acid compound, a hydroxyphenol compound, and an aldehyde compound, and a solvent (C).

Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

Provided are a curing accelerator for an oxidative polymerization type unsaturated resin having a high curing accelerating ability, and a printing ink and a coating material. Specifically, there are provided a curing accelerator for an oxidative polymerization type unsaturated resin, containing a metal complex () having an anion compound () represented by the following structural formula (1-1) or (1-2) as a ligand: ##STR00001##
wherein R.sup.1 is any one of a hydroxyl group, an amino group, a nitro group, a nitroso group, a sulfo group, a halogen atom, a hydrocarbon group which may have a substituent, a hydrocarbon oxy group which may have a substituent, and a hydrocarbon oxycarbonyl group which may have a substituent, m is 0 or an integer of 1 to 3, n is 0 or an integer of 1 to 6, and X is any one of a carboxylate group, a hydrogen atom, and the R.sup.1 group.