Patent classifications
C09D161/14
Novolac curing agent with alkoxysilyl group, method for preparing the same, composition containing the same, the cured product, and use thereof
A new novolac curing agent with an alkoxysilyl group exhibiting excellent heat resistance such as a low CTE and an high Tg when a composite is formed, a preparing method of the same, a composition including the same, a cured article, and an use thereof, are provided. The new novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a preparing method of the new novolac curing agent by alkenylation and alkoxysilylation of the novolac curing agent, a preparing method of the new novolac curing agent by alkoxysilylation of a novolac curing agent, a composition including a novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a cured article and a use thereof, are provided. A composite including a novel novolac curing agent having an alkoxysilyl group exhibits a low CTE and a high glass transition temperature.
Resist underlayer film-forming composition, resist underlayer film, resist underlayer film-forming process, and production method of patterned substrate
A resist underlayer film-forming composition includes a solvent, and a compound comprising an aromatic ring. The solvent includes a first solvent having a normal boiling point of less than 156 C., and a second solvent having a normal boiling point of no less than 156 C. and less than 300 C. The resist underlayer film-forming composition is for use in forming a resist underlayer film to be overlaid on a patterned substrate. A production method of a patterned substrate includes applying the resist underlayer film-forming composition on a patterned substrate to obtain a coating film on the patterned substrate. The coating film is heated to obtain a resist underlayer film. A resist pattern is formed on an upper face side of the resist underlayer film. The resist underlayer film and the substrate are etched using the resist pattern as a mask.
Resist underlayer film-forming composition, resist underlayer film, resist underlayer film-forming process, and production method of patterned substrate
A resist underlayer film-forming composition includes a solvent, and a compound comprising an aromatic ring. The solvent includes a first solvent having a normal boiling point of less than 156 C., and a second solvent having a normal boiling point of no less than 156 C. and less than 300 C. The resist underlayer film-forming composition is for use in forming a resist underlayer film to be overlaid on a patterned substrate. A production method of a patterned substrate includes applying the resist underlayer film-forming composition on a patterned substrate to obtain a coating film on the patterned substrate. The coating film is heated to obtain a resist underlayer film. A resist pattern is formed on an upper face side of the resist underlayer film. The resist underlayer film and the substrate are etched using the resist pattern as a mask.
Coating compositions comprising a silane modified compound
A coating composition comprising an acid functional acrylic resin and a silane modified compound is disclosed. Substrates coated at least in part with such coatings are also disclosed.
Coating compositions comprising a silane modified compound
A coating composition comprising an acid functional acrylic resin and a silane modified compound is disclosed. Substrates coated at least in part with such coatings are also disclosed.
Silica sol composition with excellent dispersibility to cyanate resin, and preparation method therefor
Disclosed are a silica sol composition including silica, an anionic dispersant, two or more epoxy silane coupling agents, and an organic solvent, and a method for preparing the same. In the silica sol composition, a uniform surface modification of silica particles may be achieved by using an anionic dispersant and two or more epoxy silane coupling agents, and it is possible to effectively enhance the compatibility between a silica filler whose surface is modified with an epoxy group and a resin which is an underfill composition.
Silica sol composition with excellent dispersibility to cyanate resin, and preparation method therefor
Disclosed are a silica sol composition including silica, an anionic dispersant, two or more epoxy silane coupling agents, and an organic solvent, and a method for preparing the same. In the silica sol composition, a uniform surface modification of silica particles may be achieved by using an anionic dispersant and two or more epoxy silane coupling agents, and it is possible to effectively enhance the compatibility between a silica filler whose surface is modified with an epoxy group and a resin which is an underfill composition.
Silica sol composition with excellent dispersibility to cyanate resin, and preparation method therefor
Disclosed are a silica sol composition including silica, an anionic dispersant, two or more epoxy silane coupling agents, and an organic solvent, and a method for preparing the same. In the silica sol composition, a uniform surface modification of silica particles may be achieved by using an anionic dispersant and two or more epoxy silane coupling agents, and it is possible to effectively enhance the compatibility between a silica filler whose surface is modified with an epoxy group and a resin which is an underfill composition.
COATING COMPOSITIONS COMPRISING A SILANE MODIFIED COMPOUND
A coating composition comprising an acid functional acrylic resin and a silane modified compound is disclosed. Substrates coated at least in part with such coatings are also disclosed.
RESIN FOR INK AND INK
A method for producing a resin for ink which includes reacting a lignin, a phenol, and an aldehyde so as to obtain a lignin-containing resol phenolic resin; and reacting the obtained lignin-containing resol phenolic resin with a rosin-based resin, and polyhydric alcohol.