A method of forming a pattern on a substrate, the method including: forming a photoresist underlayer over a surface of the substrate, wherein the photoresist underlayer is formed from a composition comprising a polymer and a solvent, and the photoresist underlayer has a carbon content of greater than 47 at %; subjecting the photoresist underlayer to a a metal precursor, where the metal precursor infiltrates a free volume of the photoresist underlayer; and exposing the metal precursor-treated photoresist underlayer to an oxidizing agent to provide a metallized photoresist underlayer.

A method of forming a pattern on a substrate, the method including: forming a photoresist underlayer over a surface of the substrate, wherein the photoresist underlayer is formed from a composition comprising a polymer and a solvent, and the photoresist underlayer has a carbon content of greater than 47 at %; subjecting the photoresist underlayer to a a metal precursor, where the metal precursor infiltrates a free volume of the photoresist underlayer; and exposing the metal precursor-treated photoresist underlayer to an oxidizing agent to provide a metallized photoresist underlayer.

A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.

A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.

A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.

The present disclosure provides methods of coating a substrate. A method includes depositing a conductive coating including an electrically conductive material over the substrate to form a conductive layer having a sheet resistivity of about 10 Ω/□ to about 1000 Ω/□. The method includes depositing an anti-icing layer comprising nanomaterials over the conductive layer to form a coating system.

The present disclosure provides methods of coating a substrate. A method includes depositing a conductive coating including an electrically conductive material over the substrate to form a conductive layer having a sheet resistivity of about 10 Ω/□ to about 1000 Ω/□. The method includes depositing an anti-icing layer comprising nanomaterials over the conductive layer to form a coating system.

An object of the present disclosure is to provide a method for manufacturing a conductive laminate having an excellent steady contact between a conductive layer and an overcoat layer. The present disclosure provides a method for manufacturing a conductive laminate 10 including a substrate 11, a conductive layer 12, and an overcoat layer 13 being laminated, the method including the following Steps: Step A: forming the conductive layer 12 on the substrate 11 using a conductive ink containing a metal nanoparticle and a first ink resin; and Step B: forming the overcoat layer 13 on the conductive layer 12 using an overcoat layer-forming composition, the overcoat layer-forming composition containing an overcoat layer resin and an overcoat layer solvent, the overcoat layer solvent having an SP value, where a difference between the SP value and an SP value of the first ink resin is 1.0 or less in absolute value.

An object of the present disclosure is to provide a method for manufacturing a conductive laminate having an excellent steady contact between a conductive layer and an overcoat layer. The present disclosure provides a method for manufacturing a conductive laminate 10 including a substrate 11, a conductive layer 12, and an overcoat layer 13 being laminated, the method including the following Steps: Step A: forming the conductive layer 12 on the substrate 11 using a conductive ink containing a metal nanoparticle and a first ink resin; and Step B: forming the overcoat layer 13 on the conductive layer 12 using an overcoat layer-forming composition, the overcoat layer-forming composition containing an overcoat layer resin and an overcoat layer solvent, the overcoat layer solvent having an SP value, where a difference between the SP value and an SP value of the first ink resin is 1.0 or less in absolute value.

The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent, where X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 1 to 10, and R.sub.1 represents at least one or more of the following general formulae (2) to (4). This aims to provide an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate. ##STR00001##