A curable composition which enables the formation of a cured product having a low dielectric constant, low dielectric loss tangent, high heat resistance, good elongation and excellent tensile strength and which has excellent film forming properties; a cured product of the curable composition; and a method for forming an insulating film using the curable composition. This curable composition contains a modified maleimide compound, a radical generator and a thiol compound. The curable composition may contain a photo-radical generator as the radical generator. The curable composition may contain a protonic acid.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be used in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be used in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

To provide a composite laminate having excellent adhesiveness to a resin material imparted to a metal base material, such as an aluminum, and a method for producing the same, and a metal-resin bonded article using the composite laminate and a method for producing the same. A composite laminate 1 includes a metal base material 2 and one layer or plural layers of a resin coating layer 4 laminated on the metal base material 2, the resin coating layer 4 is laminated on a surface-treated surface of the metal base material 2, and at least one layer of the resin coating layer 4 is formed of a resin composition containing an in situ polymerizable phenoxy resin.

To provide a composite laminate having excellent adhesiveness to a resin material imparted to a metal base material, such as an aluminum, and a method for producing the same, and a metal-resin bonded article using the composite laminate and a method for producing the same. A composite laminate 1 includes a metal base material 2 and one layer or plural layers of a resin coating layer 4 laminated on the metal base material 2, the resin coating layer 4 is laminated on a surface-treated surface of the metal base material 2, and at least one layer of the resin coating layer 4 is formed of a resin composition containing an in situ polymerizable phenoxy resin.

The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent. In the formula (1), X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 2 to 10, R.sub.1 represents at least one or more of the following formulae (2) to (4), where l1 represents 0 or 1, and l2 represents 0 or 1. Thus, provided is an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate.

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