The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.

Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: (A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (B) a laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1):

AB.sub.2O.sub.4 (1)

wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.

A compound represented by the following formula (0).

##STR00001##

(In the above formula (0), R.sup.X represents a 2n.sup.A-valent group having 1 to 70 carbon atoms or a single bond; each R.sup.1A independently represents any of an alkyl group having 1 to 30 carbon atoms and optionally having a substituent, an aryl group having 6 to 30 carbon atoms and optionally having a substituent, a crosslinkable group having 2 to 30 carbon atoms and optionally having a substituent, an alkoxy group having 1 to 30 carbon atoms and optionally having a substituent, a maleamic acid group having 4 to 30 carbon atoms and optionally having a substituent, a maleimide group having 4 to 30 carbon atoms and optionally having a substituent, a halogen atom, a nitro group, an amino group having 0 to 30 carbon atoms and optionally having a substituent, a carboxyl group, a thiol group and a hydroxy group, wherein, when R.sup.1A is any of the alkyl group, the aryl group, the crosslinkable group and the alkoxy group, at least one bond selected from the group consisting of an ether bond, a ketone bond and an ester bond is optionally contained, and at least one R.sup.1A is any of a maleamic acid group having 4 to 30 carbon atoms and optionally having a substituent and a maleimide group having 4 to 30 carbon atoms and optionally having a substituent; X represents an oxygen atom or a sulfur atom, or is optionally not present; each R independently represents any of a benzene ring, a naphthalene ring and an anthracene ring; each m is independently an integer of 0 to 9, wherein at least one m is an integer of 1 to 9; and n.sup.A is an integer of 1 to 4.)

A polyimide precursor resin composition for forming a flexible device substrate, including a polyamic acid having a structure obtained from a tetracarboxylic acid component including at least one of 3,3,4,4-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, a diamine component including at least one of paraphenylene diamine and 4,4-diaminodiphenyl ether, and a carboxylic acid monoanhydride, the polyamic acid satisfying equations (1) and (2) below:

0.97X/Y<1.00Equation (1)

0.5(Z/2)/(YX)1.05Equation (2)

in which X represents a number of moles of tetracarboxylic acid component, Y represents a number of moles of diamine component, and Z represents a number of moles of the carboxylic acid monoanhydride.

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

A method for producing an aqueous polyimide precursor solution composition includes forming a polyamic acid by the reaction of a tetracarboxylic acid component and a diamine component in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.

A terminally modified imide oligomer is represented by a specific formula including a 2-phenyl-4,4-diaminodiphenylether residue or a 4-phenoxy-1,3-diaminobenzene residue. A varnish is obtained by dissolving the terminally modified imide oligomer. A cured product is obtained by heat-curing the terminally modified imide oligomer, and a film including the cured product has a tensile elongation at break of 10% or more. An imide prepreg is obtained by impregnating fibers with the varnish and then drying the impregnated fibers. A fiber-reinforced composite material is obtained by layering and then heat-curing the imide prepreg.

A flexible electronic device containing a polyimide film exhibiting excellent C-V characteristics. The polyimide film is a film that shows a maximum gradient of 0.005/V or more in a capacitance-voltage measurement of a laminate in which a polyimide film having a film thickness of 0.75 m is formed on a silicon wafer having a resistance value of 4 cm; the maximum gradient meaning a maximum value of an absolute value of a gradient in a normalized capacity-voltage curve during a third scan of forward direction scans; a capacity-voltage curve being measured by applying a direct current voltage is to the polyimide film with respect to the silicon wafer between a lowest voltage V1 and a highest voltage V2, and measuring capacitance while the direct current voltage is scanned in a forward direction and scanned in a negative direction; the normalized capacity-voltage curve being normalized so that the capacity at the lowest voltage V1 is 1.

The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.