C09J7/25

POLYORGANOSILOXANE COMPOSITION FOR USE IN ADHESION OF A POLYPHENYLENE SULFIDE RESIN

An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

POLYORGANOSILOXANE COMPOSITION FOR USE IN ADHESION OF A POLYPHENYLENE SULFIDE RESIN

An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

Directionally reinforced products and related method

A stitch-bonded tape or other directionally stabilized product wherein stitch-bonding is carried out by overstitching yarns stitched through a sheeting or other surface substrate in conjunction with the introduction of high tenacity lay-in yarn elements disposed longitudinally in the machine direction of formation to provide strength in the length direction. The overstitching yarns secure the lay-in yarns in place relative to the surface substrate. An adhesive or other coating is disposed in covering relation to the lay-in yarn elements.

Multilayer circuit board manufacturing method

There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

FLEXIBLE WINDOW FILM AND DISPLAY APPARATUS COMPRISING SAME
20220390649 · 2022-12-08 ·

Provided are a flexible window film and a display apparatus comprising same, the flexible window film having a substrate layer, a buffer layer and a hard coating layer that are sequentially layered, wherein the buffer layer comprises, in a thickness direction, a first area in which the amount of an amide group gradually increases from the interface between the hard coating layer and the buffer layer, and a second area in which the amount of an amide group gradually decreases from the interface between the substrate layer and the buffer layer.

ELECTRONIC DEVICE INCLUDING PRINTING FILM

An electronic device includes a housing including a translucent ceramic member; and a printing film provided on the housing, wherein the printing film includes: an adhesive layer provided on the ceramic member; a base layer including a first surface facing the adhesive layer and a second surface opposite to the first surface; a printing layer provided on the first surface or the second surface of the base layer, the printing layer being viewable through the ceramic member and the adhesive layer; and a shielding printing layer facing the second surface of the base layer.

Silicon-Based Coating Composition, and Silicon-Based Release Film Comprising Same
20220380635 · 2022-12-01 · ·

The present disclosure relates to a silicone-based coating composition, and a silicone-based release film comprising the same.

CONVENIENT SPORTS TAPE
20220378620 · 2022-12-01 ·

A convenient sports tape, comprising a package body and a tape body; the package body has at least one transparent top sheet, a bottom sheet matching the top sheet with its edge connected to that of the top sheet, and a housing space formed between the top sheet and the bottom sheet, the housing space can store and clamp the tape body; the tape body is provided with at least one adhesion section, and a positioning section configured on one end of the adhesion section; the tape body has three layers in total, made up of a tape layer, an adhesive layer, and a releasing layer of the same shape; the tape layer can be configured according to the marbling of lean flesh.

Polyurethane film comprising graphene and preparation process thereof

A polyurethane film comprising a polyurethane resin and graphene, wherein the graphene is present in an amount of 1 to 30% by weight on the total weight of the film and consists of graphene nano-platelets, wherein at least 90% has a lateral dimension (x, y) of 50 to 50000 nm and a thickness (z) of 0.34 to 50 nm, wherein the lateral dimension is always greater than the thickness (x, y>z), wherein the C/O ratio is ≥100:1, and a preparation process thereof.

Polyurethane film comprising graphene and preparation process thereof

A polyurethane film comprising a polyurethane resin and graphene, wherein the graphene is present in an amount of 1 to 30% by weight on the total weight of the film and consists of graphene nano-platelets, wherein at least 90% has a lateral dimension (x, y) of 50 to 50000 nm and a thickness (z) of 0.34 to 50 nm, wherein the lateral dimension is always greater than the thickness (x, y>z), wherein the C/O ratio is ≥100:1, and a preparation process thereof.