C09J7/25

Self-adhesive composition for the bonding of substrates with low surface energy
11492518 · 2022-11-08 · ·

A hot-melt adhesive composition comprises a mixture of silylated polymers, a tackifying resin and a catalyst, in specific contents, having self-adhesive properties after crosslinking to moisture. A self-adhesive article comprises a support layer and at least one self-adhesive layer obtained after crosslinking to the moisture in the adhesive composition according to the invention. The self-adhesive article can be used to bond low-energy substrates, in particular plastic substrates, notably thermoplastic substrates having low surface energy.

Foldable backplate film and method for manufacturing foldable backplate film
11492517 · 2022-11-08 · ·

Provided are a foldable back plate film and a method of manufacturing the same.

Foldable backplate film and method for manufacturing foldable backplate film
11492517 · 2022-11-08 · ·

Provided are a foldable back plate film and a method of manufacturing the same.

Dielectric film with pressure sensitive microcapsules of adhesion promoter

Embodiments are generally directed to dielectric film with pressure sensitive microcapsules of adhesion promoter. An embodiment of an apparatus includes a dielectric film, the dielectric film including a dielectric material layer; a layer of pressure sensitive microcapsules on a first side of the dielectric material layer, the microcapsules including an adhesion promoter; and a cover material on the layer of microcapsules. The pressure sensitive microcapsules are to rupture upon application of a certain rupture pressure.

Polarizing plate-carrier film laminate, method for producing same, method for producing polarizing plate using same, and polarizing plate

A polarizing plate-carrier film laminate and a polarizing plate are provided. A method to manufacture the polarizing plate-carrier film laminate and a method to manufacture a polarizing plate using the polarizing plate-carrier film laminate are also provided. The polarizing plate-carrier film laminate includes a polarizer, a bonding agent layer and a protective film sequentially on a first surface of the polarizer and a protective layer and a carrier film sequentially on a second surface of the polarizer.

POLYESTER RESIN, AQUEOUS DISPERSION AND ADHESIVE COMPOSITION USING THE SAME

The present inventors conducted intensive studies for solving the problems. As a result, they found a heat-sealable polyester resin which can be used for food application and which exhibits excellent adhesiveness to various containers made of polystylene, polyvinyl chloride, A-PET (amorphous polyethylene terephthalate) , or polypropylene, each having different property.

The aim of the present invention is to provide a polyester resin which exhibits excellent adhesiveness to various substrates such as polystylene, polyvinyl chloride, or A-PET.

According to the present invention, there is provided a polyester resin containing a polycarboxylic acid component and a polyhydric alcohol component as constitution units, wherein, when the total amount of the polyhydric alcohol component is taken as 100 mol%, the content of diethylene glycol component is 60 mol% or more, and wherein the glass transition temperature of the polyester resin is 20° C. or lower.

ADHESIVE TAPE

Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. and 50% RH of from −0.39 to −0.20, provided that the dimensional change ratio at 23° C. and 50% RH is calculated in accordance with a predetermined equation by: cutting the pressure-sensitive adhesive tape into a belt shape having a width of 20 mm to produce a measurement sample; and tensioning the measurement sample under an environment at 23° C. and 50% RH with a tensile tester at an initial chuck-to-chuck distance set to 20 mm and a tensile rate of 300 mm/min in a longitudinal direction of the measurement sample so that a deformation amount thereof becomes 100%.

ADHESIVE TAPE

Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. and 50% RH of from −0.39 to −0.20, provided that the dimensional change ratio at 23° C. and 50% RH is calculated in accordance with a predetermined equation by: cutting the pressure-sensitive adhesive tape into a belt shape having a width of 20 mm to produce a measurement sample; and tensioning the measurement sample under an environment at 23° C. and 50% RH with a tensile tester at an initial chuck-to-chuck distance set to 20 mm and a tensile rate of 300 mm/min in a longitudinal direction of the measurement sample so that a deformation amount thereof becomes 100%.

PRESSURE-SENSITIVE ADHESIVE LAYER
20230032561 · 2023-02-02 · ·

The present application provides a pressure-sensitive adhesive layer comprising at least first and second regions having different physical properties, wherein the difference in physical properties, such as an elastic modulus or creep strain rate is maintained relatively large for each region, and the difference in physical properties, such as a peel force or recovery rate is maintained relatively small for each region.

CHANNELED SEAM TAPE
20220348797 · 2022-11-03 ·

A channeled seam tape includes a liquid permeable facer sheet attached to an adhesive portion, where the adhesive portion defines a channeled portion. A removable liner covers the adhesive portion and can be removed to press the tape onto a pair of adjacent substrate surfaces. Once the tape has been pressed onto the substrate surfaces, the adhesive portion covers a gap located between the substrate surfaces and adheres to each substrate surface.