Patent classifications
C09J101/28
BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDED BODY, AND BONDED BODY AND PASTED BODY
A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.
Method of bonding together surfaces of two or more elements and a product made by said method
A method of bonding together surfaces of two or more elements. The method includes the steps of providing two or more elements, applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other, and curing the adhesive, wherein the adhesive comprises at least one hydrocolloid.
Method of bonding together surfaces of two or more elements and a product made by said method
A method of bonding together surfaces of two or more elements. The method includes the steps of providing two or more elements, applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other, and curing the adhesive, wherein the adhesive comprises at least one hydrocolloid.
Binder composition
The invention relates to an aqueous binder composition for mineral fibers comprising at least one polyelectrolytic hydrocolloid.
Binder composition
The invention relates to an aqueous binder composition for mineral fibers comprising at least one polyelectrolytic hydrocolloid.
BINDER COMPOSITIONS AND USES THEREOF
The present invention relates to new aqueous binder compositions comprising an aqueous curable binder composition comprising starting materials required for forming a thermoset resin upon curing and a matrix polymer, wherein the starting materials required for forming a thermoset resin upon curing comprise (i) a polyhydroxy component and a polycarboxylic acid component, or an anhydride, ester or salt derivative thereof and/or reaction product thereof, or (ii) a carbohydrate component and a nitrogen containing component and/or a reaction product thereof.
Microstructure for transdermal absorption and method for manufacturing same
The present invention relates to a microstructure including a biocompatible polymer or an adhesive and to a method for manufacturing the same. The present inventors optimized the aspect ratio according to the type of each microstructure, thereby ensuring the optimal tip angle and the diameter range for skin penetration. Especially, the B-type to D-type microstructures of the present invention minimize the penetration resistance due to skin elasticity at the time of skin attachment, thereby increasing the penetration rate of the structures (60% or higher) and the absorption rate of useful ingredients into the skin. In addition, the D-type microstructure of the present invention maximizes the mechanical strength of the structure by applying a triple structure, and thus can easily penetrate the skin. When the plurality of microstructures are arranged in a hexagonal arrangement type, a uniform pressure can be transmitted to the whole microstructures on the skin.
Microstructure for transdermal absorption and method for manufacturing same
The present invention relates to a microstructure including a biocompatible polymer or an adhesive and to a method for manufacturing the same. The present inventors optimized the aspect ratio according to the type of each microstructure, thereby ensuring the optimal tip angle and the diameter range for skin penetration. Especially, the B-type to D-type microstructures of the present invention minimize the penetration resistance due to skin elasticity at the time of skin attachment, thereby increasing the penetration rate of the structures (60% or higher) and the absorption rate of useful ingredients into the skin. In addition, the D-type microstructure of the present invention maximizes the mechanical strength of the structure by applying a triple structure, and thus can easily penetrate the skin. When the plurality of microstructures are arranged in a hexagonal arrangement type, a uniform pressure can be transmitted to the whole microstructures on the skin.
Process for bonding hydrophobic surfaces having cationic guar-containing primer coating thereon
The instant invention relates to primary coating compositions that comprises a cationic polysaccharide, to be applied on a hydrophobic surface before a subsequent application of a polar or water based coating composition, such a as a paint or an adhesive.
METHOD OF PRODUCING A PLANT GROWTH SUBSTRATE
The present invention relates to a method of producing a coherent growth substrate product formed of man-made vitreous fibres (MMVF), comprising the steps of (vi) providing MMVF; (vii) providing an uncured binder composition; (viii) providing a superabsorbent polymer; (ix) forming a mixture of the MMVF, the uncured binder composition and the superabsorbent polymer; (x) curing the uncured binder composition in the mixture to form the coherent growth substrate product; wherein the uncured binder composition comprises at least one hydrocolloid.