Viscosity-modified carbohydrate binder compositions are described. The binder compositions may include a carbohydrate, a nitrogen-containing compound, and a thickening agent. The binder compositions may have a Brookfield viscosity of 7 to 50 centipoise at 20 C. The thickening agents may include modified celluloses such as hydroxyethyl cellulose (HEC) and carboxymethyl cellulose (CMC), and polysaccharides such as xanthan gum, guar gum, and starches.

Viscosity-modified carbohydrate binder compositions are described. The binder compositions may include a carbohydrate, a nitrogen-containing compound, and a thickening agent. The binder compositions may have a Brookfield viscosity of 7 to 50 centipoise at 20 C. The thickening agents may include modified celluloses such as hydroxyethyl cellulose (HEC) and carboxymethyl cellulose (CMC), and polysaccharides such as xanthan gum, guar gum, and starches.

The invention relates to an aqueous binder composition for mineral fibers comprising at least one polyelectrolytic hydrocolloid.

The invention relates to an aqueous binder composition for mineral fibers comprising at least one polyelectrolytic hydrocolloid.

The present invention relates to a method of providing thermal and/or acoustic insulation to a structure, comprising the steps of: providing a substrate which comprises fibres; applying the substrate to the structure; blending the substrate with a binder composition before, during or after application of the substrate to the structure; allowing curing of the binder composition after the substrate and the binder composition have been applied to the structure; wherein the binder composition comprises at least one hydrocolloid. The present invention also relates to an insulated structure obtainable by said method.

The invention relates to an aqueous binder composition for mineral fibers comprising at least one hydrocolloid.

The invention relates to an aqueous binder composition for mineral fibers comprising at least one hydrocolloid.

A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.

A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.