C09J101/28

Photoactive bioadhesive compositions

A novel diazirine-based biocompatible polymer that can be used as on-demand or tunable bioadhesive and applied across various clinically important surfaces. The biocompatible polymer comprises a single strand of repeating units and up to 5,000 photoreactive diazirine groups covalently attached to it. A bioadhesive composition comprises the polymer of the present invention and suitable solvents, surfactants, stabilizers, fillers and other additives. The composition may additionally contain metallic particles of size less than 50 micron made of rare earth elements and has UV or NIR transparency less than 1 optical density unit per 1 centimeter. The poly-diazirine surface grafted thin films can be used for minimally invasive surgeries.

HIGH VISCOSITY PRIMER
20180142131 · 2018-05-24 ·

A high viscosity primer and a process for preparing a polymer surface for solvent cement bonding are disclosed. The high viscosity primer has at least one solvent capable of at least partially dissolving or softening the surface and comprising a thickener ethylcellulose, PVC resin, polyvinylpyrrolidone (PVP) resin, acrylic resin, acrylonitrile butadiene styrene (ABS), pentaerythritol ethoxylate, or a combination thereof and present at a concentration in a range of from about 0.5 wt % to about 10 wt %, relative to the total weight of the primer. The high viscosity primer has a viscosity in a range of from about 10 to about 100 centipoise.

HIGH VISCOSITY PRIMER
20180142131 · 2018-05-24 ·

A high viscosity primer and a process for preparing a polymer surface for solvent cement bonding are disclosed. The high viscosity primer has at least one solvent capable of at least partially dissolving or softening the surface and comprising a thickener ethylcellulose, PVC resin, polyvinylpyrrolidone (PVP) resin, acrylic resin, acrylonitrile butadiene styrene (ABS), pentaerythritol ethoxylate, or a combination thereof and present at a concentration in a range of from about 0.5 wt % to about 10 wt %, relative to the total weight of the primer. The high viscosity primer has a viscosity in a range of from about 10 to about 100 centipoise.

MINERAL WOOL PRODUCT
20240375393 · 2024-11-14 ·

A method of bonding together surfaces of two or more elements, whereby at least one of the two or more elements is a mineral wool element, said mineral wool element(s) being bound by a mineral wool binder, comprises the steps of providing two or more elements; applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other, curing the adhesive, wherein the adhesive comprises at least one protein; at least one phenol and/or quinone containing compound, and/or at least one enzyme.

MINERAL WOOL PRODUCT
20240375393 · 2024-11-14 ·

A method of bonding together surfaces of two or more elements, whereby at least one of the two or more elements is a mineral wool element, said mineral wool element(s) being bound by a mineral wool binder, comprises the steps of providing two or more elements; applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other, curing the adhesive, wherein the adhesive comprises at least one protein; at least one phenol and/or quinone containing compound, and/or at least one enzyme.

HPMC COMPOSITION FOR PROVIDING A HEAT-SEALABLE COATING ON PAPER AND BOARD
20240368438 · 2024-11-07 ·

The present invention relates to an aqueous solution for forming a heat-sealable coating on a paper or board surface for reducing MOSH or MOAH migration, said aqueous solution comprising a thermoplastic hydroxypropyl methylcellulose (HPMC) in an amount of from 10% to 60% (w/w), wherein said HPMC has a DS(methyl) of at least 1.0 and an MS(hydroxypropyl) of at least 0.6, wherein DS is the average number of hydroxyl groups substituted by methoxyl groups per anhydroglucose unit and MS is the average number of moles of hydroxyalkoxy groups per anhydroglucose units, and wherein the viscosity of said HPMC is from 2 mPa.Math.s to 100 mPa.Math.s, determined as a 2% (w/w) solution in water at 20 C. according to Ubbelohde.

Conductive Paste For Bonding
20180072923 · 2018-03-15 ·

The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

Conductive Paste For Bonding
20180072923 · 2018-03-15 ·

The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

Method of preparing anode of lithium ion batteries or electrode plate of supercapacitor

A method of preparing an anode of lithium ion batteries or an electrode plate of a supercapacitor. The method includes admixing a terpene resin-based aqueous binder. The terpene resin-based aqueous binder includes a terpene resin emulsion including between 20 and 80 wt. % of a terpene resin, and the terpene resin emulsion has a viscosity of between 2000 and 10000 mPa.Math.s.

Method of manufacturing an electronic device
12173207 · 2024-12-24 · ·

A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.