A fabric composite for a gypsum underlayment sound control mat includes a first layer including a spunbond polyolefin layer, a second layer including a nonwoven polyolefin layer, and a hot-melt adhesive layer between and bonding the first layer and the second layer. A gypsum underlayment sound control mat may include the fabric composite bonded to an entangled mesh layer. A flooring system may include a gypsum or gypsum-concrete underlayment over the fabric composite or the mat. The fabric composite may be free of halogenated agents.

A fabric composite for a gypsum underlayment sound control mat includes a first layer including a spunbond polyolefin layer, a second layer including a nonwoven polyolefin layer, and a hot-melt adhesive layer between and bonding the first layer and the second layer. A gypsum underlayment sound control mat may include the fabric composite bonded to an entangled mesh layer. A flooring system may include a gypsum or gypsum-concrete underlayment over the fabric composite or the mat. The fabric composite may be free of halogenated agents.

A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.

A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.

A waterproof corrugated paper includes at least one stone paper medium and at least one stone liner paper, wherein the at least one stone paper medium includes a first fluting surface. A stone glue is utilized to adhere the at least one stone liner paper and several wave crests of the first fluting surface. The stone glue includes a linear polyolefin plastic material and an inorganic material. The linear polyolefin plastic material is 30 wt %-70 wt % based on the stone glue, and the inorganic material is 30 wt %-70 wt % based on the stone glue. The waterproof corrugated paper provided by the present invention is waterproof and frost-resistant, which is adapted to package cooled or frozen food. A manufacturing method, a manufacturing apparatus, and a usage of the waterproof corrugated paper are also provided in the present invention.

A waterproof corrugated paper includes at least one stone paper medium and at least one stone liner paper, wherein the at least one stone paper medium includes a first fluting surface. A stone glue is utilized to adhere the at least one stone liner paper and several wave crests of the first fluting surface. The stone glue includes a linear polyolefin plastic material and an inorganic material. The linear polyolefin plastic material is 30 wt %-70 wt % based on the stone glue, and the inorganic material is 30 wt %-70 wt % based on the stone glue. The waterproof corrugated paper provided by the present invention is waterproof and frost-resistant, which is adapted to package cooled or frozen food. A manufacturing method, a manufacturing apparatus, and a usage of the waterproof corrugated paper are also provided in the present invention.

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene-α-olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene-α-olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene-α-olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene-α-olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.