Patent classifications
C09J123/12
HIGH COHESIVE STRENGTH POLYOLEFIN CONSTRUCTION ADHESIVE
The invention includes a hot melt adhesive composition based on polyolefin polymers that can be used for construction applications in a disposable absorbent article. The olefin based hot melt adhesive composition has surprisingly good cohesive strength and a low odor.
Hot melt adhesive based on low melting point polypropylene homopolymers and methods for making and using the adhesive
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
Hot melt adhesive based on low melting point polypropylene homopolymers and methods for making and using the adhesive
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
Hot melt adhesive based on low melting point polypropylene homopolymers and methods for making and using the adhesive
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
ADHESIVE COMPOSITIONS AND USE THEREOF
The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications.
POLYCHLOROPRENE-BASED BONDING ADHESIVES
An adhesive composition comprising a solids component, said solids component including a rubber component that includes polychloroprene; and a solvent component, said solvent component including t-butyl acetate.
POLYCHLOROPRENE-BASED BONDING ADHESIVES
An adhesive composition comprising a solids component, said solids component including a rubber component that includes polychloroprene; and a solvent component, said solvent component including t-butyl acetate.
Hot Melt Adhesive Composition
The present disclosure provides a composition. In an embodiment an adhesive composition is provided and includes A) a propylene based plastomer or elastomer (PBPE) comprising up to 10 wt % units derived from ethylene and having (i) a Koenig B-value less than 1.0; (ii) a total unsaturation per mole of propylene from 0.01% to 0.03%; (iii) a density from 0.870 g/cc to 0.890 g/cc; (iv) a melt viscosity at 177° C. from 800 mPa.Math.s to 11,000 mPa.Math.s; and (v) a weight average molecular weight from 20,000 to 50,000 g/mol; B) a tackifies; and C) a wax.
Adhesive resin laminate, laminate, and method of producing same
Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.
Adhesive resin laminate, laminate, and method of producing same
Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.