Patent classifications
C09J123/14
Adhesive composition for absorbent articles
Described herein is an adhesive composition including a copolymer. The adhesive composition has a viscosity of from about 2,000 mPa.Math.s to about 11,500 mPa.Math.s at 150° C. The adhesive composition has a Storage Modulus at 37° C. of from about 3 MPa to 9.5 MPa. The adhesive composition has a Yield Stress at 37° C. of from about 0.8 MPa to about 1.45 MPa.
Protective film
A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.
Protective film
A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.
Thermoplastic molding compounds
The invention relates to thermoplastic molding compounds having melt viscosities of less than 30,000 mPas for use as a hot-melt adhesive, comprising the components A and B, wherein component A comprises one or more C.sub.3/C.sub.2 copolymers each produced with metallocene catalysts and each having a melt viscosity at 170° C. of less than 20,000 mPas, measured according to DIN 53019, and a molecular weight M.sub.W of 1000 g/mol to 50,000 g/mol, and component B comprises one or more C.sub.2/C.sub.3 copolymers each produced with metallocene catalysts and each having a melt flow index MI of 1 to 100 g/m in, measured at 190° C./2.16 kg, according to ASTM D 1238, and a molecular weight M.sub.W of 50,000 g/mol to 300,000 g/mol. Said thermoplastic molding compounds, because of the viscosity and mechanical properties thereof, are suitable for fiber mesh applications.
Thermoplastic molding compounds
The invention relates to thermoplastic molding compounds having melt viscosities of less than 30,000 mPas for use as a hot-melt adhesive, comprising the components A and B, wherein component A comprises one or more C.sub.3/C.sub.2 copolymers each produced with metallocene catalysts and each having a melt viscosity at 170° C. of less than 20,000 mPas, measured according to DIN 53019, and a molecular weight M.sub.W of 1000 g/mol to 50,000 g/mol, and component B comprises one or more C.sub.2/C.sub.3 copolymers each produced with metallocene catalysts and each having a melt flow index MI of 1 to 100 g/m in, measured at 190° C./2.16 kg, according to ASTM D 1238, and a molecular weight M.sub.W of 50,000 g/mol to 300,000 g/mol. Said thermoplastic molding compounds, because of the viscosity and mechanical properties thereof, are suitable for fiber mesh applications.
HOT MELT ADHESIVES AND USES THEREOF
The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functionalized wax, functionalized olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.
HOT MELT ADHESIVES AND USES THEREOF
The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functionalized wax, functionalized olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.
HOT MELT ADHESIVES AND USES THEREOF
The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functionalized wax, functionalized olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.
High Temperature Polymer Adhesive and Laminate Using the Adhesive
A polymer adhesive includes a polymer base comprising an ethylene and/or propylene copolymer and a crosslinking agent selected from the group consisting of hydroxyalkyl amides, melamines, and aziridines. A laminate includes a first substrate, a second substrate, and the polymer adhesive between the first substrate and the second substrate.
High Temperature Polymer Adhesive and Laminate Using the Adhesive
A polymer adhesive includes a polymer base comprising an ethylene and/or propylene copolymer and a crosslinking agent selected from the group consisting of hydroxyalkyl amides, melamines, and aziridines. A laminate includes a first substrate, a second substrate, and the polymer adhesive between the first substrate and the second substrate.