Disclosed is a high-penetration hot melt adhesive for separation apparatus, such as thin film composite reverse osmosis filtration membranes. Also disclosed is a method of using these hot melt adhesives to bond these membranes to one or more other components of a separation apparatus.

Provided is an adhesive composition having high holding power. Provided is an adhesive composition comprising a ring-opened copolymer containing a structural unit derived from a monocyclic olefin and a structural unit derived from a polycyclic olefin; and a tackifying resin.

A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

The invention relates to the technical field of cohesive bandages. The invention relates to a bandage comprising a flat web material as a substrate, both main sides of the substrate being coated at least partially with a hot-melt adhesive. The invention also relates to a hot-melt adhesive for producing a bandage, to the use of a hot-melt adhesive for producing bandages, and to a method for producing a bandage. The hot-melt adhesive is based on a first polyolefin having—a proportion of 1-butene-derived monomer units; a proportion of ethylene-derived monomer units; and the hot-melt adhesive further comprises: at least one tackifier consisting of hydrocarbon resin and/or of hydrogenated hydrocarbon resin. The hot-melt adhesive can also contain a second polyolefin, preferably an amorphous polypropylene homo- or copolymer.

The invention relates to the technical field of cohesive bandages. The invention relates to a bandage comprising a flat web material as a substrate, both main sides of the substrate being coated at least partially with a hot-melt adhesive. The invention also relates to a hot-melt adhesive for producing a bandage, to the use of a hot-melt adhesive for producing bandages, and to a method for producing a bandage. The hot-melt adhesive is based on a first polyolefin having—a proportion of 1-butene-derived monomer units; a proportion of ethylene-derived monomer units; and the hot-melt adhesive further comprises: at least one tackifier consisting of hydrocarbon resin and/or of hydrogenated hydrocarbon resin. The hot-melt adhesive can also contain a second polyolefin, preferably an amorphous polypropylene homo- or copolymer.

Provided is a self-adhesive sheet including a 4-methyl-1-pentene-based polymer. In the self-adhesive sheet, it is preferable that at least one or more temperatures showing a local maximum value of a loss tangent (tan δ) , which is obtained by dynamic viscoelasticity measurement under conditions of a temperature rising rate of 4° C./min, a frequency of 1.59 Hz, and a strain amount of 0.1%, are present in a range of 10° C. or higher and 100° C. or lower, the local maximum value of the loss tangent is 0.5 or more and 3.5 or less, an arithmetic average roughness Ra on one surface of the self-adhesive sheet is in a range of 0.01 to 10 .Math.m, and a ten-point average roughness Rz is in a range of 0.1 to 50 .Math.m.

This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

The invention features hot melt adhesive compositions including from 50% by weight to 95% by weight of a non-single site catalyzed amorphous poly alpha-olefin copolymer derived from propylene and at least one monomer selected from the group consisting of butene and hexene and having a viscosity of no greater 10,000 cP at 190° C. and from 5% by weight to 45% by weight of a polybutene-1 polymer.