A method of making an adhesive for an ice protection assembly includes transferring Z-CNTs from a substrate carrier into the adhesive. De-bonding of the adhesive for ice protection assembly inspection or repair or repositioning at initial installation includes heating the Z-CNTs in the adhesive to soften the adhesive and allow for easy removal.

Electrolysis methods and systems using membranes with acrylamide moieties are disclosed herein. A disclosed method of electrolysis includes providing an electrolytic cell comprising an anode, a cathode and a membrane positioned therebetween, supplying a reaction fluid comprising CO.sub.x or H.sub.2O to the cathode, applying a first voltage across the anode and cathode, and collecting an electrochemical reaction product from the electrolytic cell. The membrane includes a polymer including a first repeat unit which includes an acrylamide moiety.

A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.

A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.

A pressure sensitive adhesive particle includes a pressure sensitive adhesive base particle that contains a styrene resin containing styrene and a vinyl monomer other than styrene as polymerization components, and a (meth)acrylate resin containing at least two (meth)acrylates as polymerization components, in which a mass ratio of the (meth)acrylates relative to a total of polymerization components of the (meth)acrylate resin is 90 mass % or more; and an external additive. The pressure sensitive adhesive particle has a surface having an arithmetic average roughness Ra within a range of 0.005 m to 0.100 m. The pressure sensitive adhesive particle has at least two glass transition temperatures, and the difference between the lowest glass transition temperature and the highest glass transition temperature among the glass transition temperatures of the pressure sensitive adhesive particle is 30 C. or more.

A pressure sensitive adhesive particle includes a pressure sensitive adhesive base particle that contains a styrene resin containing styrene and a vinyl monomer other than styrene as polymerization components, and a (meth)acrylate resin containing at least two (meth)acrylates as polymerization components, in which a mass ratio of the (meth)acrylates relative to a total of polymerization components of the (meth)acrylate resin is 90 mass % or more; and an external additive. The pressure sensitive adhesive particle has a surface having an arithmetic average roughness Ra within a range of 0.005 m to 0.100 m. The pressure sensitive adhesive particle has at least two glass transition temperatures, and the difference between the lowest glass transition temperature and the highest glass transition temperature among the glass transition temperatures of the pressure sensitive adhesive particle is 30 C. or more.

A hydrophobic binder/adhesive, for treating a substrate, may include about 60% to 98.9% by weight bulk polymer selected from one or more monomers associated with styrene, vinyl acetate, acrylic acid ester, methacrylic acid esters, ethylene, or butadiene; about 0.1% to about 10.0%, by weight of one or more hydrophobic monomers selected from stearyl methacrylate or laurel acrylate; and about 1% to about 30%, by weight of one or more protective colloids associated with a hard resin polymer. The hydrophobic binder/adhesive may increase resistance to wetting of the substrate when expose to moisture, and increases durability of the substrate.

A hydrophobic binder/adhesive, for treating a substrate, may include about 60% to 98.9% by weight bulk polymer selected from one or more monomers associated with styrene, vinyl acetate, acrylic acid ester, methacrylic acid esters, ethylene, or butadiene; about 0.1% to about 10.0%, by weight of one or more hydrophobic monomers selected from stearyl methacrylate or laurel acrylate; and about 1% to about 30%, by weight of one or more protective colloids associated with a hard resin polymer. The hydrophobic binder/adhesive may increase resistance to wetting of the substrate when expose to moisture, and increases durability of the substrate.

An adhesive material contains a styrene resin, a (meth)acrylate resin, and an oxidatively polymerizable compound, wherein the adhesive material has a sea-island structure that includes a sea portion containing the styrene resin and an island portion containing the (meth)acrylate resin, and the glass transition temperature of the (meth)acrylate resin is at least 30 C. lower than the glass transition temperature of the styrene resin.

An adhesive material contains a styrene resin, a (meth)acrylate resin, and an oxidatively polymerizable compound, wherein the adhesive material has a sea-island structure that includes a sea portion containing the styrene resin and an island portion containing the (meth)acrylate resin, and the glass transition temperature of the (meth)acrylate resin is at least 30 C. lower than the glass transition temperature of the styrene resin.