Described herein is a foam adhesive article comprising: a closed cell foam layer comprising an extruded thermoplastic polymer foam and particles distributed therein, wherein the particles comprise a plurality of hollow particles, wherein the hollow particles comprise at least one of thermoplastic expanded polymeric particles, glass particles, and mixtures thereof; and a plurality of sorbent particles. Also disclosed herein are precursor compositions and methods of making such constructions.

The present application is directed to a crosslinkable copolymer comprising styrene and 4-vinyl benzocyclobutene monomers and at least one alkoxysilane group, a method for generating an ultrathin copolymer film, which contains at least one crosslinked copolymer as defined herein, on a silicon-containing substrate, a composition or film comprising at least one copolymer as defined herein, as well as the use of this copolymer or composition containing it for electrical insulation and/or bonding of silicon-containing substrates.

The present application is directed to a crosslinkable copolymer comprising styrene and 4-vinyl benzocyclobutene monomers and at least one alkoxysilane group, a method for generating an ultrathin copolymer film, which contains at least one crosslinked copolymer as defined herein, on a silicon-containing substrate, a composition or film comprising at least one copolymer as defined herein, as well as the use of this copolymer or composition containing it for electrical insulation and/or bonding of silicon-containing substrates.

This invention is intended to synthesize a multi-branched polymer, which has an uniform molecular chain lengths and is free from branch defects, without the need for purification. This invention is also intended to synthesize a polyfunctional radical polymerization initiator represented by Formula 1: ##STR00001##
wherein n is an integer of 1 or larger; Y is a polyfunctional unsaturated compound; R.sub.1 is a hydrocarbon group; R.sub.2 is a structure in which one molecule of a radically polymerizable unsaturated hydrocarbon compound is bound to R.sub.1 and the oxygen atom; X.sub.1 of BX.sub.1 (boron-X.sub.1) bond is an alkoxy or phenyl group; and X.sub.2 of BX.sub.2 (boron-X.sub.2) bond is an alkoxy or phenyl group.

This invention is intended to synthesize a multi-branched polymer, which has an uniform molecular chain lengths and is free from branch defects, without the need for purification. This invention is also intended to synthesize a polyfunctional radical polymerization initiator represented by Formula 1: ##STR00001##
wherein n is an integer of 1 or larger; Y is a polyfunctional unsaturated compound; R.sub.1 is a hydrocarbon group; R.sub.2 is a structure in which one molecule of a radically polymerizable unsaturated hydrocarbon compound is bound to R.sub.1 and the oxygen atom; X.sub.1 of BX.sub.1 (boron-X.sub.1) bond is an alkoxy or phenyl group; and X.sub.2 of BX.sub.2 (boron-X.sub.2) bond is an alkoxy or phenyl group.

The present invention is a temporary adhesion method for temporarily bonding a support and a wafer via a temporary adhesive material, including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25 C. and a thermosetting polymer layer (B) exhibiting a storage modulus E of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25 C. after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A), forming the layer (B) on the support by laminating a film resin (B), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A), forming the layer (B) on the layer (A) by laminating the film resin (B), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.

The present invention is a temporary adhesion method for temporarily bonding a support and a wafer via a temporary adhesive material, including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25 C. and a thermosetting polymer layer (B) exhibiting a storage modulus E of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25 C. after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A), forming the layer (B) on the support by laminating a film resin (B), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A), forming the layer (B) on the layer (A) by laminating the film resin (B), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

The powder adhesive comprises a thermoplastic resin and particles of an aromatic compound, wherein the particles of an aromatic compound are particles of a compound that has an aromatic ring and an azo bond bonded to the aromatic ring, or are particles of a compound comprising a heteroaromatic ring comprising nitrogen atom; the thermoplastic resin comprises an ester group; and, designating Es (mmol/g) as an ester group concentration in the thermoplastic resin, M (mass %) as a content of the aromatic compound particles in the powder adhesive, and N (mmol/g) as a nitrogen atom concentration in the aromatic compound particles, Es is from 1.0 mmol/g to 4.5 mmol/g, M is from 1.010.sup.4 mass % to 1.010.sup.0 mass %, and N is from 5.0 mmol/g to 15.0 mmol/g.