The powder adhesive comprises a thermoplastic resin and particles of an aromatic compound, wherein the particles of an aromatic compound are particles of a compound that has an aromatic ring and an azo bond bonded to the aromatic ring, or are particles of a compound comprising a heteroaromatic ring comprising nitrogen atom; the thermoplastic resin comprises an ester group; and, designating Es (mmol/g) as an ester group concentration in the thermoplastic resin, M (mass %) as a content of the aromatic compound particles in the powder adhesive, and N (mmol/g) as a nitrogen atom concentration in the aromatic compound particles, Es is from 1.0 mmol/g to 4.5 mmol/g, M is from 1.010.sup.4 mass % to 1.010.sup.0 mass %, and N is from 5.0 mmol/g to 15.0 mmol/g.

The present invention provides methods and systems for a hot melt pressure sensitive adhesive and thermoset that comprises from about 5 to about 50 wt. % of a block copolymer, from about 0 to about 75 wt. % of a tackifying resin, from about 0 to about 45 wt. % of an oil, and from about 0 to about 3 wt. % of an antioxidant.

The present invention provides methods and systems for a hot melt pressure sensitive adhesive and thermoset that comprises from about 5 to about 50 wt. % of a block copolymer, from about 0 to about 75 wt. % of a tackifying resin, from about 0 to about 45 wt. % of an oil, and from about 0 to about 3 wt. % of an antioxidant.

A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

The present invention provides a manufacture method of a graphene based resin pellet and a manufacture method of conductive seal. The present invention provides a manufacture method of a graphene based resin pellet, which employs green environmental protection flashing light for deoxidizing graphene oxide with an exposure method. The process is simple and easy to control. The method can be utilized for mass production. The present invention provides a manufacture method of conductive seal, which utilizes the graphene based resin pellet to be a conductive particle for replacing the conductive gold ball commonly used in the conductive seal according to prior art, and the process of manufacturing graphene based resin pellet in the method is green environmental protective to prevent the heavy metal pollution problem during the production procedure of the conductive gold ball; the graphene oxide used for manufacturing the graphene based resin pellet is effective presoma of massively manufacturing graphene material, and the source is widely available and the production cost can be effectively reduced.

The present invention is a temporary adhesion method for temporarily bonding a support and a wafer via a temporary adhesive material, including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25 C. and a thermosetting polymer layer (B) exhibiting a storage modulus E of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25 C. after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A), forming the layer (B) on the support by laminating a film resin (B), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A), forming the layer (B) on the layer (A) by laminating the film resin (B), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.

The present invention is a temporary adhesion method for temporarily bonding a support and a wafer via a temporary adhesive material, including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25 C. and a thermosetting polymer layer (B) exhibiting a storage modulus E of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25 C. after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A), forming the layer (B) on the support by laminating a film resin (B), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A), forming the layer (B) on the layer (A) by laminating the film resin (B), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.