A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof and has a glass transition temperature of 100° C. or higher, and the (meth)acrylic polymer block (B) contains at least one selected from compounds represented by general formula (1) as a major constitutional monomer thereof and has a glass transition temperature of 10° C. or below.
CH.sub.2═CR.sup.1—C(═O)O(R.sup.2O).sub.n—R.sup.3  (1)
(wherein, R.sup.1 represents hydrogen or a methyl group; R.sup.2 represents a linear or branched C.sub.2-6 alkylene group; R.sup.3 represents hydrogen, a C.sub.1-20 alkyl group, or a C.sub.6-20 aryl group; and n represents 0 or an integer from 1 to 100.)

A pressure-sensitive adhesive composition includes a block copolymer containing a polymer block (A) and a (meth)acrylic polymer block (B), wherein the polymer block (A) contains either or both of a maleimide compound and an amide group-containing vinyl compound as a constitutional monomer thereof and has a glass transition temperature of 100° C. or higher, and the (meth)acrylic polymer block (B) contains at least one selected from compounds represented by general formula (1) as a major constitutional monomer thereof and has a glass transition temperature of 10° C. or below.
CH.sub.2═CR.sup.1—C(═O)O(R.sup.2O).sub.n—R.sup.3  (1)
(wherein, R.sup.1 represents hydrogen or a methyl group; R.sup.2 represents a linear or branched C.sub.2-6 alkylene group; R.sup.3 represents hydrogen, a C.sub.1-20 alkyl group, or a C.sub.6-20 aryl group; and n represents 0 or an integer from 1 to 100.)

A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated film used for temporarily fixing a semiconductor member to a support member includes a first curable resin layer, a metal foil, and a second curable resin layer laminated in sequence.

A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated film used for temporarily fixing a semiconductor member to a support member includes a first curable resin layer, a metal foil, and a second curable resin layer laminated in sequence.

An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

A method of covering a roof deck involves adhering a preformed, self adhering single ply roofing membrane which includes a water impermeable membrane, a pressure sensitive, hot melt adhesive adhered to one side of the water impermeable membrane, and a release liner on the side of the pressure sensitive, hot melt adhesive opposite of the water impermeable membrane.

A method of covering a roof deck involves adhering a preformed, self adhering single ply roofing membrane which includes a water impermeable membrane, a pressure sensitive, hot melt adhesive adhered to one side of the water impermeable membrane, and a release liner on the side of the pressure sensitive, hot melt adhesive opposite of the water impermeable membrane.

An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.

An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.