A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23 C. and greater than 23 C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23 C. and greater than 23 C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

A composition for sealing defects in structural materials such as roads or paved surfaces, the composition preferably comprising one or more shape memory polymer (xamSMP) components capable of responding to increased temperature by decreasing in volume.

A composition for sealing defects in structural materials such as roads or paved surfaces, the composition preferably comprising one or more shape memory polymer (xamSMP) components capable of responding to increased temperature by decreasing in volume.

A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1VB 1)/VA1}100 (Formula 2): Vx2=1(VA2VB2)/VA2100

A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1VB 1)/VA1}100 (Formula 2): Vx2=1(VA2VB2)/VA2100

The present invention provides a heat shrinkable multilayer film which has excellent adhesiveness between front and back layers and an interlayer not only at normal temperature but also at low temperature to effectively prevent delamination and is less likely to have residual white streaks along creases. The present invention also provides a heat shrinkable label including the heat shrinkable multilayer film. The present invention relates to a heat shrinkable multilayer film including: front and back layers each containing a polyester resin; an interlayer containing a polystyrene resin; and adhesive layers, the front and back layers and the interlayer being stacked with the adhesive layers interposed therebetween, the adhesive layers each containing 20 to 65% by weight of a polystyrene resin and 35 to 80% by weight of a polyester elastomer.

The present invention provides a heat shrinkable multilayer film which has excellent adhesiveness between front and back layers and an interlayer not only at normal temperature but also at low temperature to effectively prevent delamination and is less likely to have residual white streaks along creases. The present invention also provides a heat shrinkable label including the heat shrinkable multilayer film. The present invention relates to a heat shrinkable multilayer film including: front and back layers each containing a polyester resin; an interlayer containing a polystyrene resin; and adhesive layers, the front and back layers and the interlayer being stacked with the adhesive layers interposed therebetween, the adhesive layers each containing 20 to 65% by weight of a polystyrene resin and 35 to 80% by weight of a polyester elastomer.

A hot-melt composition includes, with respect to 100 parts by mass of (A) a hydrogenated styrene thermoplastic elastomer having styrene-based polymer blocks at both ends and a hydrogenated diene polymer block at a middle portion and having a mass-average molecular weight of 250,000-600,000, 20-150 parts by mass of (B) a first styrene-based tackifying resin having a softening point of 135-160 C., 100-400 parts by mass of (C) a second styrene-based tackifying resin having a softening point of 105-135 C., 100-500 parts by mass of (D) a third tackifying resin for the hydrogenated diene polymer block having a softening point of 100-160 C. and 500-1,500 parts by mass of (E) a liquid softener. The hot-melt composition has excellent adhesion and easy peel ability, and is a material suitable as a sealing material for a lighting device of an automobile or the like.

A hot-melt composition includes, with respect to 100 parts by mass of (A) a hydrogenated styrene thermoplastic elastomer having styrene-based polymer blocks at both ends and a hydrogenated diene polymer block at a middle portion and having a mass-average molecular weight of 250,000-600,000, 20-150 parts by mass of (B) a first styrene-based tackifying resin having a softening point of 135-160 C., 100-400 parts by mass of (C) a second styrene-based tackifying resin having a softening point of 105-135 C., 100-500 parts by mass of (D) a third tackifying resin for the hydrogenated diene polymer block having a softening point of 100-160 C. and 500-1,500 parts by mass of (E) a liquid softener. The hot-melt composition has excellent adhesion and easy peel ability, and is a material suitable as a sealing material for a lighting device of an automobile or the like.