An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

The present invention relates to an adhesive tape having a layer structure in which an adhesive layer, a first film layer (I), a base material layer, and a second film layer (II) are arranged in this order, in which the base material layer satisfies a predetermined requirement that a ratio (a)/(b) of a thickness (a) to a thickness (b) is not less than 1.7 or not more than 0.6 in which the thickness (a) is a thickness from the first film layer (I)-side of the base material layer to the outer surface of the adhesive layer and the thickness (b) is a thickness from the second film layer (II)-side surface of the base material layer to the outer surface of the second film layer (II), and at least one layer constituting the layer structure contains a flame retardant (C).

The present invention relates to an adhesive tape having a layer structure in which an adhesive layer, a first film layer (I), a base material layer, and a second film layer (II) are arranged in this order, in which the base material layer satisfies a predetermined requirement that a ratio (a)/(b) of a thickness (a) to a thickness (b) is not less than 1.7 or not more than 0.6 in which the thickness (a) is a thickness from the first film layer (I)-side of the base material layer to the outer surface of the adhesive layer and the thickness (b) is a thickness from the second film layer (II)-side surface of the base material layer to the outer surface of the second film layer (II), and at least one layer constituting the layer structure contains a flame retardant (C).

A set of structurally insulated panels and method of building construction, the set of panels having an indexing system that allows for any one panel to be easily attached to any other panel via indexing pins placed in pre-arranged openings. The indexing system enables essentially any number of panels to be assembled in essentially any reasonable manner to construct a building structure.

A set of structurally insulated panels and method of building construction, the set of panels having an indexing system that allows for any one panel to be easily attached to any other panel via indexing pins placed in pre-arranged openings. The indexing system enables essentially any number of panels to be assembled in essentially any reasonable manner to construct a building structure.

A film is described comprises a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.

A multilayer adhesive tape is provided, including: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer sequentially. At least one of the first outer adhesive layer and the second outer adhesive layer includes a cured product of an outer adhesive composition including a high molecular weight prepolymer having a weight average molecular weight of 100,000 g/mol or more and 1,500,000 g/mol or less and a low molecular weight prepolymer having a weight average molecular weight of 1,000 g/mol or more and 80,000 g/mol or less.

A multilayer adhesive tape is provided, including: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer sequentially. At least one of the first outer adhesive layer and the second outer adhesive layer includes a cured product of an outer adhesive composition including a high molecular weight prepolymer having a weight average molecular weight of 100,000 g/mol or more and 1,500,000 g/mol or less and a low molecular weight prepolymer having a weight average molecular weight of 1,000 g/mol or more and 80,000 g/mol or less.

An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains a polymerization control agent. At least one of the main agent and the initiator further contains a peroxide.

An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains a polymerization control agent. At least one of the main agent and the initiator further contains a peroxide.