Adhesive compositions that can be applied to substrates using inkjet printheads and cured to a hardened, tack-free state and readily rendered tacky on application of heat and pressure to accurately transfer foil to the substrates including one or more free-radical curing monomers, an oligomer/resin composition component including one or more oligomers and one or more inert thermoplastic resins that are soluble in the monomers, and, where required, one or more free radical photoinitiators.

Adhesive compositions that can be applied to substrates using inkjet printheads and cured to a hardened, tack-free state and readily rendered tacky on application of heat and pressure to accurately transfer foil to the substrates including one or more free-radical curing monomers, an oligomer/resin composition component including one or more oligomers and one or more inert thermoplastic resins that are soluble in the monomers, and, where required, one or more free radical photoinitiators.

The present invention provides a bio-electrode composition including a silsesquioxane bonded to an N-carbonyl sulfonamide salt, wherein the N-carbonyl sulfonamide salt is shown by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a linear, branched, or cyclic alkylene group having 1 to 20 carbon atoms that may have an aromatic group, an ether group, or an ester group, or an arylene group having 6 to 10 carbon atoms; Rf represents a linear, branched, or cyclic alkyl group having 1 to 4 carbon atoms containing at least one fluorine atom; M.sup.+ is an ion selected from a lithium ion, a sodium ion, a potassium ion, and a silver ion. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light-weight, manufacturable at low cost, and free from large lowering of the electric conductivity even though it is wetted with water or dried.

The present invention provides a bio-electrode composition including a silsesquioxane bonded to an N-carbonyl sulfonamide salt, wherein the N-carbonyl sulfonamide salt is shown by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a linear, branched, or cyclic alkylene group having 1 to 20 carbon atoms that may have an aromatic group, an ether group, or an ester group, or an arylene group having 6 to 10 carbon atoms; Rf represents a linear, branched, or cyclic alkyl group having 1 to 4 carbon atoms containing at least one fluorine atom; M.sup.+ is an ion selected from a lithium ion, a sodium ion, a potassium ion, and a silver ion. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light-weight, manufacturable at low cost, and free from large lowering of the electric conductivity even though it is wetted with water or dried.

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

Pressure-sensitive adhesive compositions that contain polymer microspheres with an average particle size of 20 μm to 100 μm, the polymer microspheres synthesized using the disclosed suspension polymerization techniques and include at least three structural isomers of a secondary (meth)acrylate of Formula (I), where R.sup.1 and R.sup.2 are each independently H or a C.sub.1 to C.sub.10 saturated linear alkyl group, the sum of the number of carbons in R.sup.1 and R.sup.2 is 7 to 18, inclusive, and R.sup.3 is H or CH.sub.3. The disclosed pressure-sensitive adhesive compositions may be used in masking articles to provide holding power to, clean paint-lines on, low surface energy adhesion to, and excellent damage-free removal from painted surfaces.

##STR00001##

Pressure-sensitive adhesive compositions that contain polymer microspheres with an average particle size of 20 μm to 100 μm, the polymer microspheres synthesized using the disclosed suspension polymerization techniques and include at least three structural isomers of a secondary (meth)acrylate of Formula (I), where R.sup.1 and R.sup.2 are each independently H or a C.sub.1 to C.sub.10 saturated linear alkyl group, the sum of the number of carbons in R.sup.1 and R.sup.2 is 7 to 18, inclusive, and R.sup.3 is H or CH.sub.3. The disclosed pressure-sensitive adhesive compositions may be used in masking articles to provide holding power to, clean paint-lines on, low surface energy adhesion to, and excellent damage-free removal from painted surfaces.

##STR00001##

An adhesive tape with high high-load holding power, initial adhesive strength, and repeelability is provided. An adhesive layer of the adhesive tape contains filler particles and a triblock copolymer with a repeating unit represented by the following general formula (1):

##STR00001##

A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their monomer units respectively. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure, and * denotes a bonding arm to another atom. A relationship D50/T between an average particle size D50 of the filler particles and an average thickness T of the adhesive layer ranges from 0.05 to 1.0.

An adhesive tape with high high-load holding power, initial adhesive strength, and repeelability is provided. An adhesive layer of the adhesive tape contains filler particles and a triblock copolymer with a repeating unit represented by the following general formula (1):

##STR00001##

A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their monomer units respectively. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure, and * denotes a bonding arm to another atom. A relationship D50/T between an average particle size D50 of the filler particles and an average thickness T of the adhesive layer ranges from 0.05 to 1.0.