Patent classifications
C09J133/16
Optical assembly using low DN/DT optical adhesive
Embodiments of an optical assembly and methods of making it are provided. The optical assembly includes a first waveguide, a second waveguide, and an optical adhesive for transmitting optical signals between the first waveguide and the second waveguide. The adhesive includes about 20% to about 60% by volume of first monomers. The first monomers have at least two acrylate or methacrylate groups. The optical adhesive also includes about 40% to about 80% by volume of second monomers. The second monomers have at least one fluorine atom and at least one acrylate or methacrylate group. The optical adhesive has a refractive index of from about 1.40 to about 1.55, and in the temperature range of about 10 C. to about 85 C., the refractive index of the optical adhesive has a thermal drift dn/dT of less than the absolute magnitude of |410.sup.4/ C.| and the sign of that value is negative.
A FLUORINATED PRESSURE SENSITIVE ADHESIVES AND ARTICLES THEREOF
Described herein is a pressure sensitive adhesive comprising a high molecular weight fluorinated polymer having a Tg less than about 0 C. and a number average molecular weight greater than about 20 kilograms/mole; and a low molecular weight fluorinated polymer derived from an ethylenically unsaturated fluorinated monomer, wherein the low molecular weight fluorinated polymer has a Tg greater than about 15 C. and a number average molecular weight less than about 18 kilograms/mole. Also described herein are articles comprising the pressure sensitive adhesive composition.
A FLUORINATED PRESSURE SENSITIVE ADHESIVES AND ARTICLES THEREOF
Described herein is a pressure sensitive adhesive comprising a high molecular weight fluorinated polymer having a Tg less than about 0 C. and a number average molecular weight greater than about 20 kilograms/mole; and a low molecular weight fluorinated polymer derived from an ethylenically unsaturated fluorinated monomer, wherein the low molecular weight fluorinated polymer has a Tg greater than about 15 C. and a number average molecular weight less than about 18 kilograms/mole. Also described herein are articles comprising the pressure sensitive adhesive composition.
Semiconductor device manufacturing method and underfill film
A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/ C. from a temperature 10 C. higher than a minimum melt viscosity attainment temperature to a temperature 10 C. higher than the temperature.
Semiconductor device manufacturing method and underfill film
A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/ C. from a temperature 10 C. higher than a minimum melt viscosity attainment temperature to a temperature 10 C. higher than the temperature.
PRESSURE-SENSITIVE ADHESIVE TAPE, PRESSURE-SENSITIVE ADHESIVE TAPE FOR AFFIXING COMPONENT FOR ELECTRONIC APPLIANCE, AND TRANSPARENT PRESSURE-SENSITIVE ADHESIVE TAPE FOR OPTICAL USE
The present invention aims to provide an adhesive tape excellent in resistance against sebum to be able to maintain its adhesive force even when applied to a part frequently touched with human hands, and an adhesive tape for fixing electronic device component and a transparent adhesive tape for optical use each provided with the adhesive tape. The present invention relates to an adhesive tape including an adhesive layer containing an acrylic adhesive, the adhesive layer having a swelling ratio of 100% or more and 130% or less after immersion in oleic acid under the conditions of a temperature of 60 C. and a humidity of 90% for 24 hours.
Thermoresponsive adhesive material, method of making the material and methods of use
The present disclosure is directed to a thermoresponsive adhesive material. The material comprises a linear, phase-separated polymer having fluorinated polymer units and hydrophobic polymer units. The fluorinated polymer units and the hydrophobic polymer units are randomly ordered along the polymer. The hydrophobic polymer units include a first hydrophobic polymer unit and a second hydrophobic polymer unit. The first hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl groups or alkenyl groups has 16 to 20 carbon atoms. The second hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl or alkenyl groups of the second hydrophobic polymer unit has 5 to 14 carbon atoms. A peak adhesive strength of the thermoresponsive adhesive material is modifiable and reversible with a change in temperature. Methods of making thermoresponsive adhesive materials, methods employing thermoresponsive adhesive materials and self-adhesive objects that include thermoresponsive adhesive materials are also disclosed.
Thermoresponsive adhesive material, method of making the material and methods of use
The present disclosure is directed to a thermoresponsive adhesive material. The material comprises a linear, phase-separated polymer having fluorinated polymer units and hydrophobic polymer units. The fluorinated polymer units and the hydrophobic polymer units are randomly ordered along the polymer. The hydrophobic polymer units include a first hydrophobic polymer unit and a second hydrophobic polymer unit. The first hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl groups or alkenyl groups has 16 to 20 carbon atoms. The second hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl or alkenyl groups of the second hydrophobic polymer unit has 5 to 14 carbon atoms. A peak adhesive strength of the thermoresponsive adhesive material is modifiable and reversible with a change in temperature. Methods of making thermoresponsive adhesive materials, methods employing thermoresponsive adhesive materials and self-adhesive objects that include thermoresponsive adhesive materials are also disclosed.
MULTIFUNCTIONAL MONOMERS, METHODS FOR MAKING MULTIFUNCTIONAL MONOMERS, POLYMERIZABLE COMPOSITIONS AND PRODUCTS FORMED THEREFORM
The present invention provides multifunctional monomers, including, but not limited to include multifunctional methylene malonate and methylene beta-ketoester monomers; methods for producing the same; and compositions and products formed therefrom. The multifunctional monomers of the invention may be produced by transesterification or by direct synthesis from monofunctional methylene malonate monomers or methylene beta-ketoester monomers. The present invention further compositions and products formed from methylene beta-ketoester monomers of the invention, including monomer-based products (e.g., inks, adhesives, coatings, sealants or reactive molding) and polymer-based products (e.g., fibers, films, sheets, medical polymers, composite polymers and surfactants).
MULTIFUNCTIONAL MONOMERS, METHODS FOR MAKING MULTIFUNCTIONAL MONOMERS, POLYMERIZABLE COMPOSITIONS AND PRODUCTS FORMED THEREFORM
The present invention provides multifunctional monomers, including, but not limited to include multifunctional methylene malonate and methylene beta-ketoester monomers; methods for producing the same; and compositions and products formed therefrom. The multifunctional monomers of the invention may be produced by transesterification or by direct synthesis from monofunctional methylene malonate monomers or methylene beta-ketoester monomers. The present invention further compositions and products formed from methylene beta-ketoester monomers of the invention, including monomer-based products (e.g., inks, adhesives, coatings, sealants or reactive molding) and polymer-based products (e.g., fibers, films, sheets, medical polymers, composite polymers and surfactants).