Provided is a compound represented by Formula (1) given below. (In the formula, R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a hydrogen atom, a phenyl group, a C.sub.1 to 8 alkyl group, or a C.sub.1 to 4 perfluoroalkyl group, X.sup.1 represents a hydrogen atom or a hydroxy group, Y.sup.1 represents a C.sub.1 to 9 alkylene group containing a fluorine atom or a C.sub.1 to 9 alkylene group containing no fluorine atom, and n.sup.1 is an integer from 0 to 3.).

Provided is a compound represented by Formula (1) given below. (In the formula, R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a hydrogen atom, a phenyl group, a C.sub.1 to 8 alkyl group, or a C.sub.1 to 4 perfluoroalkyl group, X.sup.1 represents a hydrogen atom or a hydroxy group, Y.sup.1 represents a C.sub.1 to 9 alkylene group containing a fluorine atom or a C.sub.1 to 9 alkylene group containing no fluorine atom, and n.sup.1 is an integer from 0 to 3.).

A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/ C. from a temperature 10 C. higher than a minimum melt viscosity attainment temperature to a temperature 10 C. higher than the temperature.

A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/ C. from a temperature 10 C. higher than a minimum melt viscosity attainment temperature to a temperature 10 C. higher than the temperature.

The present invention provides an adhesive composition comprising a tertiary amine group-containing acrylic copolymer and a sulfonate group-containing acrylic copolymer, a polarizing plate and a liquid crystal display device comprising the adhesive composition. The adhesive composition of the present invention comprises a tertiary amine group-containing acrylic copolymer and a sulfonate group-containing acrylic copolymer wherein an ionic functional group can be introduced by cross-linking reaction thereof, thereby exhibiting good antistatic properties and excellent durability.

The present invention provides an adhesive composition comprising a tertiary amine group-containing acrylic copolymer and a sulfonate group-containing acrylic copolymer, a polarizing plate and a liquid crystal display device comprising the adhesive composition. The adhesive composition of the present invention comprises a tertiary amine group-containing acrylic copolymer and a sulfonate group-containing acrylic copolymer wherein an ionic functional group can be introduced by cross-linking reaction thereof, thereby exhibiting good antistatic properties and excellent durability.

The present invention provides methylene beta-ketoester monomers, methods for producing the same, and compositions and products formed therefrom. In the method for producing the methylene beta-ketoesters of the invention, a beta-ketoester is reacted with a source of formaldehyde in a modified Knoevenagel reaction optionally in the presence of an acidic or basic catalyst, and optionally in the presence of an acidic or non-acidic solvent, to form reaction complex. The reaction complex may be an oligomeric complex. The reaction complex is subjected to further processing, which may be vaporization by contact with an energy transfer means in order to isolate the beta-ketoester monomer. The present invention further compositions and products formed from methylene beta-ketoester monomers of the invention, including monomer-based products (e.g., inks, adhesives, coatings, sealants or reactive molding) and polymer-based products (e.g., fibers, films, sheets, medical polymers, composite polymers and surfactants).

The present invention provides methylene beta-ketoester monomers, methods for producing the same, and compositions and products formed therefrom. In the method for producing the methylene beta-ketoesters of the invention, a beta-ketoester is reacted with a source of formaldehyde in a modified Knoevenagel reaction optionally in the presence of an acidic or basic catalyst, and optionally in the presence of an acidic or non-acidic solvent, to form reaction complex. The reaction complex may be an oligomeric complex. The reaction complex is subjected to further processing, which may be vaporization by contact with an energy transfer means in order to isolate the beta-ketoester monomer. The present invention further compositions and products formed from methylene beta-ketoester monomers of the invention, including monomer-based products (e.g., inks, adhesives, coatings, sealants or reactive molding) and polymer-based products (e.g., fibers, films, sheets, medical polymers, composite polymers and surfactants).

The present invention provides multifunctional monomers, including, but not limited to include multifunctional methylene malonate and methylene beta-ketoester monomers; methods for producing the same; and compositions and products formed therefrom. The multifunctional monomers of the invention may be produced by transesterification or by direct synthesis from monofunctional methylene malonate monomers or methylene beta-ketoester monomers. The present invention further compositions and products formed from methylene beta-ketoester monomers of the invention, including monomer-based products (e.g., inks, adhesives, coatings, sealants or reactive molding) and polymer-based products (e.g., fibers, films, sheets, medical polymers, composite polymers and surfactants).

An adhesive film includes an upper protective layer, a lower protective layer, and an adhesive layer between the upper protective layer and the lower protective layer. The adhesive layer includes a first adhesive layer and a second adhesive layer on the first adhesive layer. The first adhesive layer includes an acrylic resin, a photoinitiator, and a monofunctional monomer. The second adhesive layer includes an acrylic resin, a photoinitiator, and a multifunctional monomer.