The present invention relates to a phenol-based resin adhesive from lignin pyrolysis, comprising a polymer of phenol and formaldehyde from lignin pyrolysis, wherein the phenol from lignin pyrolysis comprises at least two phenols from lignin pyrolysis or at least two lignin-modified phenols from lignin pyrolysis. A repeat unit of the polymer of phenol and formaldehyde from lignin pyrolysis comprises at least two phenol units from lignin pyrolysis or at least two lignin-modified phenol units from lignin pyrolysis. According to the phenol-based resin adhesive from lignin pyrolysis in the present invention, by-products during the pyrolysis of lignin for power generation are used as raw materials, so it is environment-friendly and economical.

The present invention relates to a phenol-based resin adhesive from lignin pyrolysis, comprising a polymer of phenol and formaldehyde from lignin pyrolysis, wherein the phenol from lignin pyrolysis comprises at least two phenols from lignin pyrolysis or at least two lignin-modified phenols from lignin pyrolysis. A repeat unit of the polymer of phenol and formaldehyde from lignin pyrolysis comprises at least two phenol units from lignin pyrolysis or at least two lignin-modified phenol units from lignin pyrolysis. According to the phenol-based resin adhesive from lignin pyrolysis in the present invention, by-products during the pyrolysis of lignin for power generation are used as raw materials, so it is environment-friendly and economical.

The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender. Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20 C., at least equal to 1000%. Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.

The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender. Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20 C., at least equal to 1000%. Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.

The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender. Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20 C., at least equal to 1000%. Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.

Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40 C. which is performed by applying a load of 500 g.

Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40 C. which is performed by applying a load of 500 g.

A latex of a highly saturated nitrile rubber wherein the highly saturated nitrile rubber contains ,-ethylenically unsaturated nitrile monomer units in a ratio of 10 to 60 wt %, has an iodine value of 120 or less, and has a weight average molecular weight of solubles in chloroform of 100,000 or less, and when removing volatiles contained in the latex and making a film of the highly saturated nitrile rubber, a loss tangent tan .sub.(50 C.) at 50 C. of the film is 0.3 to 0.6 and a complex torque S* at the time of 100% shear strain at 100 C. of the film is 20 dNm or less, and an adhesive composition containing the latex are provided.

A latex of a highly saturated nitrile rubber wherein the highly saturated nitrile rubber contains ,-ethylenically unsaturated nitrile monomer units in a ratio of 10 to 60 wt %, has an iodine value of 120 or less, and has a weight average molecular weight of solubles in chloroform of 100,000 or less, and when removing volatiles contained in the latex and making a film of the highly saturated nitrile rubber, a loss tangent tan .sub.(50 C.) at 50 C. of the film is 0.3 to 0.6 and a complex torque S* at the time of 100% shear strain at 100 C. of the film is 20 dNm or less, and an adhesive composition containing the latex are provided.

The present invention provides a novel cyanic acid ester compound that has excellent solvent solubility and provides a cured product having a low rate of thermal expansion and having excellent flame retardance and heat resistance, and a resin composition containing the compound, etc. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board excellent in peel strength, glass transition temperature, rate of thermal expansion, rate of water absorption, and thermal conductivity. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board not only having a high glass transition temperature and low thermal expansibility but being also excellent in flexural modulus and thermal conductivity. The cyanic acid ester compound is represented by the general formula (1):

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