Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

A polyphenylene ether oligomer and a polyphenylene ether oligomer are provided. The polyphenylene ether oligomer has a structure represented by Formula (I): ##STR00001## wherein each R.sup.1 can be independently hydrogen, C.sub.1-6 alkyl group, or phenyl group; each R.sup.2 can be independently hydrogen, C.sub.1-6 alkyl group, or phenyl group; a:(a+b) is from 0.05:1 to 1:1; n:(a+b) is from 0.05:1 to 5:1; Q can be ##STR00002##
m can be 0 or an integer from 1 to 4; Ra can be C.sub.1-6 alkylene group; Rb can be C.sub.1-6 alkylene group; each X is independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methacryloyl group, propargyl group, or cyanol group; and wherein the polyphenylene ether oligomer can have a number average molecular weight from 400 to 2,000.

A polyphenylene ether oligomer and a polyphenylene ether oligomer are provided. The polyphenylene ether oligomer has a structure represented by Formula (I): ##STR00001## wherein each R.sup.1 can be independently hydrogen, C.sub.1-6 alkyl group, or phenyl group; each R.sup.2 can be independently hydrogen, C.sub.1-6 alkyl group, or phenyl group; a:(a+b) is from 0.05:1 to 1:1; n:(a+b) is from 0.05:1 to 5:1; Q can be ##STR00002##
m can be 0 or an integer from 1 to 4; Ra can be C.sub.1-6 alkylene group; Rb can be C.sub.1-6 alkylene group; each X is independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methacryloyl group, propargyl group, or cyanol group; and wherein the polyphenylene ether oligomer can have a number average molecular weight from 400 to 2,000.

An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.

A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support.

##STR00001##

R.sup.1 is a divalent organic group including at least one aromatic ring, each of two oxygen atoms bonded to R.sup.1 in (A1) is bonded to the aromatic ring, and, when R.sup.1 includes two or more aromatic rings, each of the two oxygen atoms is bonded to any one of the aromatic rings.

A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support.

##STR00001##

R.sup.1 is a divalent organic group including at least one aromatic ring, each of two oxygen atoms bonded to R.sup.1 in (A1) is bonded to the aromatic ring, and, when R.sup.1 includes two or more aromatic rings, each of the two oxygen atoms is bonded to any one of the aromatic rings.

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.