Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

The present invention provides an adhesive composition, which can be cured through three ways: UV-radiation curing, thermal-radiation curing and moisture-curing. The adhesive composition comprises a) an oligomer having an isocyanate group and a (meth)acryloxy group; b) a (meth)acrylic monomer and/or oligomer not having an isocyanate group; c) a photoinitiator; and d) a peroxide.

The present invention provides an adhesive composition, which can be cured through three ways: UV-radiation curing, thermal-radiation curing and moisture-curing. The adhesive composition comprises a) an oligomer having an isocyanate group and a (meth)acryloxy group; b) a (meth)acrylic monomer and/or oligomer not having an isocyanate group; c) a photoinitiator; and d) a peroxide.

A composition includes methyl methacrylate MMA, at least one elastomer or a core-shell polymer, and at least one radical former, as an adhesive, sealant or coaling for gluing, sealing or coaling substrates containing plasticized PVC.

A composition includes methyl methacrylate MMA, at least one elastomer or a core-shell polymer, and at least one radical former, as an adhesive, sealant or coaling for gluing, sealing or coaling substrates containing plasticized PVC.

Optically clear curable adhesive films that are heat conformable prior to setting include a reactive composition. The curable films are flexible and free-standing, and have a complex viscosity of greater than 100,000 poise (10,000 Pascal seconds) at 25° C. and less than 100 poise (10 Pascal seconds) at 85° C., prior to setting. The set film has an adhesive shear strength of greater than 100 Newtons per square centimeter (N/cm.sup.2) to a glass substrate when measured according to the Shear Adhesion Test Method. The reactive composition includes an ethylenically unsaturated polyester-containing oligomeric composition that is the reaction product of a saturated, amorphous co-polyester polyol and a compound with a terminal polyol-reactive group and a terminal ethylenically unsaturated group, a (meth)acrylate functional material, and at least one initiator.

Optically clear curable adhesive films that are heat conformable prior to setting include a reactive composition. The curable films are flexible and free-standing, and have a complex viscosity of greater than 100,000 poise (10,000 Pascal seconds) at 25° C. and less than 100 poise (10 Pascal seconds) at 85° C., prior to setting. The set film has an adhesive shear strength of greater than 100 Newtons per square centimeter (N/cm.sup.2) to a glass substrate when measured according to the Shear Adhesion Test Method. The reactive composition includes an ethylenically unsaturated polyester-containing oligomeric composition that is the reaction product of a saturated, amorphous co-polyester polyol and a compound with a terminal polyol-reactive group and a terminal ethylenically unsaturated group, a (meth)acrylate functional material, and at least one initiator.

A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.