A family of low-molecular-weight, main-chain thermotropic liquid-crystalline polyimides (TLC-PI) that are crosslinkable is disclosed. These all-aromatic TLC-PI are derived from (i) wholly aromatic and flexible diamine monomers, in which the linkage between the two aniline-ends contains a relatively high heat-tolerant but flexible chain constituted by two or more units of 1,4-phenoxy or 1,3-phenoxy or in combinations of both. Processes of making and using such all-aromatic TLC-PI is also provided.

A family of low-molecular-weight, main-chain thermotropic liquid-crystalline polyimides (TLC-PI) that are crosslinkable is disclosed. These all-aromatic TLC-PI are derived from (i) wholly aromatic and flexible diamine monomers, in which the linkage between the two aniline-ends contains a relatively high heat-tolerant but flexible chain constituted by two or more units of 1,4-phenoxy or 1,3-phenoxy or in combinations of both. Processes of making and using such all-aromatic TLC-PI is also provided.

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

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A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an aldehyde or ketone and an amine salt of an inorganic acid. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products.

A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180 C. or higher. More preferably, the reaction initiation temperature is 200 C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.

An adhesive film that can solve the problem of pickup defect and improve the yield rate of semiconductor packages. The adhesive film includes: (A) a bismaleimide resin; (B) a radical initiator; and (C) a coupling agent that contains a (meth)acrylic group. Further, an adhesive film with dicing tape, which includes such an adhesive film laminated onto a dicing tape, is provided. Furthermore, a semiconductor package that includes such an adhesive film with dicing tape is provided.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide-terminated polyamide-imide polymer. The present disclosure further relates to an adhesive composition comprising a cured adhesive, wherein the cured adhesive is the reaction product of said curable precursor, and to a process for making said curable precursor of an adhesive composition, the process comprising reacting an amine-terminated polyamide with a bis-maleimide by a poly-Michael-Addition.

Provided are a curable maleimide resin composition that can avoid the usage of a problematic solvent, such as NMP among aprotic polar solvents, having a high boiling point and toxicity, can be cured at a relatively low temperature, and provide a cured product having a superior adhesiveness to semiconductor materials. The curable maleimide resin composition contains: (A) a maleimide compound that has a number average molecular weight of 5,000 to 50,000; (B) a reaction initiator; and (C) a silane coupling agent that has one or more epoxy groups in one molecule; and optionally (D) a diaminotriazine ring-containing imidazole.

There are provided a photosensitive resin composition having excellent heat resistance, developability, and curability, a laminate obtained by using a photosensitive resin composition, a method for manufacturing a semiconductor device, and a semiconductor device.

The photosensitive resin composition includes a polymer including a repeating unit derived from an acid group-containing maleimide, a crosslinking agent, a photopolymerization initiator, and a thermal polymerization initiator. The polymer preferably further includes a repeating unit derived from a vinyl compound.