The adhesive tape includes: a resin layer that is formed by applying resin coating, the resin coating containing a resin having an acid number of 50 mg/g or more and 130 mg/g or less, and at least one type of cross-linking agent selected from between an epoxy-based cross-linking agent and a metal chelate cross-linking agent; and an adhesive layer that is laminated on or above the resin layer, and is formed by applying adhesive coating, the adhesive coating containing a resin including a hydroxyl group, and a metal chelate compound.

The adhesive tape includes: a resin layer that is formed by applying resin coating, the resin coating containing a resin having an acid number of 50 mg/g or more and 130 mg/g or less, and at least one type of cross-linking agent selected from between an epoxy-based cross-linking agent and a metal chelate cross-linking agent; and an adhesive layer that is laminated on or above the resin layer, and is formed by applying adhesive coating, the adhesive coating containing a resin including a hydroxyl group, and a metal chelate compound.

A latex composition containing a carboxy-modified polymer latex, a xanthogen compound, and a typical metal compound in a form other than an oxide. This latex composition has excellent stability, can avoid delayed (Type IV) allergic reactions in addition to immediate (Type I) allergic reactions, and can provide a molded film, such as a dip-molded product, having excellent tear strength and tensile strength. Also a molded film and a substrate with an adhesive layer which are obtained using the latex composition.

Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows: ##STR00001##

Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows: ##STR00001##

An adhesive for heat press molding contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.

The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200 C. from 5.010.sup.4 Pa to 4.010.sup.5 Pa.

The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200 C. from 5.010.sup.4 Pa to 4.010.sup.5 Pa.

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150 C. and a crystallization temperature of 50 to 90 C., an acid-modified polymer B having a melting point of 30 to 110 C. and a crystallization temperature of lower than 50 C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70 C.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23 C. to 400 C. in the air at a heating rate of 10 C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.