An adhesive resin composition includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin. ##STR00001##

A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

Provided is a temporary adhesive that has good applicability and adhesiveness and allows an adherend to be easily peeled off by a slide peeling method or a blade peeling method. The temporary adhesive of the present disclosure contains, as resin components, a polyvalent vinyl ether compound (A), a polymer (B) having a plurality of hydroxy groups and/or carboxy groups as pendant groups, and a thermoplastic resin (C). The polymer (B) has a weight average molecular weight from 1500 to 7000, the thermoplastic resin (C) has a weight average molecular weight greater than 7000, and the resin components contained in the temporary adhesive have a weight average molecular weight less than or equal to 100000. A weight average molecular weight of the resin components contained in a heat-treated product formed by heating the temporary adhesive at 230 C. for 5 minutes is more than or equal to 1.2 times as great as the weight average molecular weight of the resin components contained in the temporary adhesive, the heat-treated product has a Tg higher than or equal to 100 C. and lower than 200 C., and the heat-treated product has a viscosity, at 200 C. and a frequency of 10 Hz, of less than or equal to 100 cP.

Provided is a temporary adhesive that has good applicability and adhesiveness and allows an adherend to be easily peeled off by a slide peeling method or a blade peeling method. The temporary adhesive of the present disclosure contains, as resin components, a polyvalent vinyl ether compound (A), a polymer (B) having a plurality of hydroxy groups and/or carboxy groups as pendant groups, and a thermoplastic resin (C). The polymer (B) has a weight average molecular weight from 1500 to 7000, the thermoplastic resin (C) has a weight average molecular weight greater than 7000, and the resin components contained in the temporary adhesive have a weight average molecular weight less than or equal to 100000. A weight average molecular weight of the resin components contained in a heat-treated product formed by heating the temporary adhesive at 230 C. for 5 minutes is more than or equal to 1.2 times as great as the weight average molecular weight of the resin components contained in the temporary adhesive, the heat-treated product has a Tg higher than or equal to 100 C. and lower than 200 C., and the heat-treated product has a viscosity, at 200 C. and a frequency of 10 Hz, of less than or equal to 100 cP.

The present disclosure provides a photomask and a method for fabricating a semiconductor structure with a photomask. The photomask includes a substrate, and a polymer layer over a surface of the substrate, wherein the polymer layer includes a thermoplastic polymer and a hydrophobic layer, wherein the thermoplastic polymer is between the hydrophobic layer and the surface of the photomask.

The present disclosure provides a photomask and a method for fabricating a semiconductor structure with a photomask. The photomask includes a substrate, and a polymer layer over a surface of the substrate, wherein the polymer layer includes a thermoplastic polymer and a hydrophobic layer, wherein the thermoplastic polymer is between the hydrophobic layer and the surface of the photomask.