The present invention relates to an adhesive label intended to be secured to a blood bag made of Polyvinyl chloride (PVC), styrenic block copolymer, polypropylene or the like, wherein the adhesive label comprises a flexible support and a layer of pressure-sensitive adhesive deposited on a surface of the support; wherein the label is noteworthy in that the support has a mineral filler rate of silica and/or calcium carbonate (CaCO3) and/or the like, of less than 50%, and wherein at 115 C., the support has an elongation greater than or equal to 2% when a test piece 1.5 cm wide of the support is suspended under tension by a weight of 375 g for minutes, and wherein the blood bag at 115 C. has an elongation of at least 100% when a 1.5 cm wide test piece of a blood bag is suspended under tension by a weight of 375 g for 75 minutes.

A gas turbine engine component assembly includes a ceramic component having a first thermal characteristic. A metallic component has a second thermal characteristic. A bonding material secures the ceramic component to the metallic component. The bonding material includes at least one of a transient liquid phase bond and a partial transient liquid phase bond. The bonding material is configured to withstand a shear stress parameter relating to a differential between the first and second thermal characteristics.

Provided are curable compositions that include an epoxy resin; a 9,9-bis(aminophenyl)fluorene or derivative therefrom; and core shell particles, each comprising an elastomeric core and a polymeric outer shell layer coated on the elastomeric core. The core shell particles can be at least partially aggregated with each other, include polymeric intermediate layers between the core and outer shell layers, and/or have a multimodal particle diameter distribution. The curable compositions may also optionally include inorganic sub-micron particles dispersed in the curable composition, the inorganic sub-micron particles having surface-bonded organic groups that compatibilize the inorganic sub-micron particles and the epoxy resin.

A method for bonding together two substrates includes providing a molecular glue including glue molecules, each of the glue molecules having at least two OSi or OAl moieties; reacting a surface of a first substrate with the molecular glue to attach the glue molecules to the surface of the first substrate by at least one of the OSi or OAl moieties; and reacting a surface of a second substrate with the molecular glue to attach the glue molecules to the surface of the second substrate by at least another one of the OSi or OAl moieties. The method can be used for a variety of applications including manufacturing a vapor cell.

To provide a heat radiation member having a smaller size and high performance. A transfer sheet including the following layers laminated in the following order: a release layer including a releasable film; a first adhesive layer, which includes a poly(vinyl formal) resin; a thermally conductive material layer including a carbon material; and a second adhesive layer, which includes a poly(vinyl formal) resin.

A pressure sensitive adhesive sheet for batteries that includes a base material, a vapor-deposition insulating film provided on one surface side of the base material, and a pressure sensitive adhesive layer provided on a surface side of the vapor-deposition insulating film opposite to the base material.

Disclosed is a high-dielectric adhesive film, particularly a high-dielectric adhesive film including a substrate layer, a ceramic-mixed layer formed on one surface of the substrate layer and an adhesive layer formed on the surface of the substrate layer on which the ceramic-mixed layer is formed. The high-dielectric adhesive film thus configured is improved in permittivity due to the use of a ceramic component, thus preventing the malfunction of electronic devices, increasing the stability and performance thereof, and exhibiting heat dissipation effects.

Computing devices may require disassembly to repair or replace a defective or damaged component, or to facilitate recycling at the end of the computing device's service life. While pressure sensitive adhesive (PSA) is good at creating secure connections between components within the expected operating conditions of the computing device, PSA resists intentional disassembly of such components. The presently disclosed PSA with thermally conductive release tabs provides a mechanism for effective spot-cooling of the PSA between adhered components. Once the PSA reaches a low temperature threshold, one component may be mechanically separated from another component. This yields potentially faster and easier disassembly of adhered components than prior art techniques.

A lightweight electromagnetic wave shielding tape is disclosed. The tape includes a first polymer protective layer, a calendered conductive material layer coupled to a bottom side of the first polymer protective layer, and a second polymer protective layer coupled to a bottom side of the conductive material layer so that the conductive material layer is encapsulated within the protective layers. An adhesive layer can also be applied to one of the protective layers.

A water barrier laminate including inorganic barrier and water-trapping layers alternately arranged in order from the side facing the device to the outer side: a first inorganic barrier layer, a first water-trapping layer, a second inorganic barrier layer, a second water-trapping layer and a third inorganic barrier layer. A water-permeable underlying plastic layer is provided on one side of these inorganic barrier layers; a distance L1a between the first water-trapping layer and the first inorganic barrier layer and a distance L2a between the second water-trapping layer and the second barrier satisfy formulas (1) and (2):
L1a<3 ?m(1)
L2a<3 ?m(2)
and a distance L1b between the second inorganic barrier layer and the first water-trapping layer satisfies formula (3):
L1b?3 ?m(3)
by interposing a water-permeable organic layer therebetween.