Patent classifications
C09J2400/143
Thermally conductive composite silicone rubber sheet and method for manufacturing same
Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressure-sensitive adhesive made of a polymer of a monomer mixture in which 5-50 mol % of hydroxyl group-containing monomers are contained in all of the constituent monomers; and 0.05-5 parts by mass of a chelate-based curing agent with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, and the thermally conductive silicone rubber sheet has a thermally conductive silicone rubber layer which, as a cured product of a thermally conductive silicone composition containing a thermally conductive filler, has a durometer A hardness of 60-96.
EPOXY BASED REINFORCING PATCHES HAVING IMPROVED DAMPING LOSS FACTOR
A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
METHOD FOR CREATING AN ADHESIVE BOND USING AN ELASTOMERIC MATERIAL
Embodiments herein provides a system for creating an adhesive bond using elastomeric material. The system includes the steps of (i) a first material, the first material having a first material length and a first material width, (ii) a second material, the second material having a second material length and a second material width, (iii) a gap between the first material and the second material, (iv) an elastomeric material substantially filling at least a portion of the height and length of the gap between the first material and the second material. The gap includes a height and a length. The height being substantially equal to a distance between the first material and the second material and the length being substantially orthogonal to the height and defined by a degree of overlap between the first and second materials.
METHOD FOR SEPARATING JOINED OBJECT
To provide a separation method for a joined object for display device, by which PSA can be peeled off even when the PSA is tightly bonded to a member in the joined object. Provided is a method for separating a joined object for display device. In this method, the joined object comprises two members joined with a PSA comprising a hydrophilicity enhancer. The method comprises a step of peeling the PSA from the member by supplying steam towards the PSA.
Methods of bonding substrates together
Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.
EPOXY BASED REINFORCING PATCHES HAVING IMPROVED DAMPING LOSS FACTOR
A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
METHODS OF BONDING SUBSTRATES TOGETHER
Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.
Pressure-sensitive adhesive and articles including same
According to at least one embodiment, there is provided a pressure-sensitive adhesive which includes 100 parts by mass of (A) an acrylic polymer having a glass transition temperature of −50 to −25° C., 0.01-3 parts by mass of (B) a silane coupling agent having an epoxy group, 0.01-0.9 parts by mass of (C) a compound having two or more epoxy groups in the molecule, and 0.01-0.5 parts by mass of (D) an organic polyvalent-metal compound. Another embodiment is a decorative sheet which includes a layer including the pressure-sensitive adhesive. Other embodiments include the front panel of a door for opening/closing a front part of an article main body, which includes a layer including the pressure-sensitive adhesive.
JOINT TAPE
Joint tape 1 for attachment to a ceiling or a wall, the joint tape 1 comprising a layer of permeable non-woven material 2 and an adhesive layer 3 attached to the permeable non-woven material 2, the adhesive layer 3 being applied to one side of the non-woven material in a pattern comprising sections 21 without adhesive applied thereto and wherein the joint tape 1 has a width of 3 mm to 20 mm.
PHOTO-CROSSLINKABLE PRESSURE-SENSITIVE ADHESIVE AND USE THEREOF
Provided is a photo-crosslinkable PSA comprising a polymer having side-chain benzophenone structures. The photo-crosslinkable PSA is a cured product of a PSA composition comprising an ethylenically unsaturated compound and a benzophenone structure-containing component. The photo-crosslinkable PSA has VOC emissions of 500 μg/g or less. Also provided is a PSA sheet having a PSA layer formed from the photo-crosslinkable PSA.