A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.

Provided are a moisture resistance improver that yields a water-based adhesive for inorganic materials having exceptional adhesiveness of inorganic materials, and a water-based adhesive for inorganic materials in which the moisture resistance improver is used. The present invention is a moisture resistance improver (J) for a water-based adhesive for inorganic materials containing at least one (co)polymer (A) selected from the group consisting of (co)polymer (A1) and (co)polymer (A2). (Co)polymer (A1): a (co)polymer having a weight-average molecular weight of 3,000-150,000, and containing, as structural monomers, a C3-30 unsaturated (poly)carboxylic acid (anhydride) (a1) and a (meth)acrylic acid ester (a2) having solubility of 10 g or less per 100 g of water at 25° C. (Co)polymer (A2): a (co)polymer having a weight-average molecular weight of 6,000-150,000, and containing the above unsaturated (poly)carboxylic acid (anhydride) (a1) as a structural monomer but not containing the above (meth)acrylic acid ester (a2) as a structural monomer.

A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

The present invention relates to a method of producing a coherent growth substrate product formed of man-made vitreous fibres (MMVF), comprising the steps of (vi) providing MMVF; (vii) providing an uncured binder composition; (viii) providing a superabsorbent polymer; (ix) forming a mixture of the MMVF, the uncured binder composition and the superabsorbent polymer; (x) curing the uncured binder composition in the mixture to form the coherent growth substrate product; wherein the uncured binder composition comprises at least one hydrocolloid.

A formaldehyde-free binder composition for mineral fibers which comprises at least one phenol containing compound and at least one protein.

An aqueous binder composition for mineral fibers which comprises at least one polyelectrolytic hydrocolloid.

A protein adhesive of a novel sequence is disclosed. The protein adhesive according to the present disclosures enables adhesion between two non-biological materials or between a non-biological material and a biological material, thereby being applicable to various fields.

A method and a mineral wool product include a multiple of lamellae, such as a sandwich panel core. The product includes a plurality of lamellae cut from a mineral wool web, and bonded together by applying an adhesive on the surfaces of two adjacent lamellae to form a web-like product, wherein the adhesive comprises at least one hydrocolloid.

The invention relates to an aqueous binder composition for mineral fibers comprising at least one polyelectrolytic hydrocolloid.

Provided is an image frame includes a polymer film including an image layer on a first main surface of the polymer film; a glass cover layer located over the first main surface of the polymer film with the image layer between the glass cover layer and the polymer film; and an adhesive film between the polymer film and the glass cover layer. The image frame may be displayed in more various forms without distortion and may be preserved long time without quality degradation.