The present invention relates to a method of providing thermal and/or acoustic insulation to a structure, comprising the steps of: providing a substrate which comprises fibres; applying the substrate to the structure; blending the substrate with a binder composition before, during or after application of the substrate to the structure; allowing curing of the binder composition after the substrate and the binder composition have been applied to the structure; wherein the binder composition comprises at least one hydrocolloid. The present invention also relates to an insulated structure obtainable by said method.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

An adhesive composition is provided that includes a block copolymer present at greater than or equal to 30 total weight percent of the adhesive system comprising a high glass transition temperature in subunits Y and Y, each of the subunits Y and Y having a high glass transition temperature of from 70? C. to 130? C. with a low glass transition temperature subunit Z having a low glass transition temperature of from ?100? C. to 10? C. intermediate between said high glass transition temperature acrylate subunits to define a structure Y-Z-Y. The triblock copolymer is dissolved in a monomer curable under free radical. A free radical initiator of a peroxide or a hydroperoxide are present in combination with a sulfonyl chloride, dihydropyridine and copper or vanadium salt. By heating the cured adhesive at or above 70? C., the adhesive is amenable to being removed, repaired, or reworked.

A method and a mineral wool product include a multiple of lamellae, such as a sandwich panel core. The product includes a plurality of lamellae cut from a mineral wool web, and bonded together by applying an adhesive on the surfaces of two adjacent lamellae to form a web-like product, wherein the adhesive comprises at least one hydrocolloid.

The invention relates to a mineral wool product comprising mineral fibres bound by a cured binder wherein the binder in its uncured state comprises at least one protein, and at least one enzyme.

The invention relates to a formaldehyde-free binder composition for mineral fibres comprising at least one phenol and/or quinone containing compound, and at least one protein.

The invention relates to a method of bonding together surfaces of two or more elements, whereby at least one of the two or more elements is a mineral wool element, said mineral wool element(s) being bound by a mineral wool binder, the method comprising the steps of providing two or more elements; applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other; curing the adhesive, wherein the adhesive comprises at least one protein; at least one phenol and/or quinone containing compound, and/or at least one enzyme.

Provided is a dispersion capable of enhancing the transparency and the heat shielding property of an obtained interlayer film for laminated glass when a material containing the dispersion is used as a material for the interlayer film for laminated glass. The dispersion according to the present invention includes tin-doped indium oxide particles having at least one configuration selected from the group consisting of a first configuration (when a sum total of integrated intensities of peaks in wide-angle X-ray scattering is represented by I.sub.t, and integrated intensity of a peak of (222) plane is represented by I.sub.0, I.sub.0/I.sub.t is less than 0.380), a second configuration (when integrated intensity of a peak of (222) plane in wide-angle X-ray scattering is represented by I.sub.0, and integrated intensity of a peak of (622) plane is represented by I.sub.a, I.sub.a/I.sub.0 is 0.31 or more) and a third configuration (when integrated intensity of a peak of (222) plane in wide-angle X-ray scattering is represented by I.sub.0, and integrated intensity of a peak of (440) plane is represented by I.sub.b, I.sub.b/I.sub.0 is 0.41 or more), and a dispersion medium.

A method of producing a wine glass (W) to which a decorative piece (J) is mounted and permanently held in place. The method includes first selecting a decorative piece from a plurality of decorative pieces, then cleaning a portion of the glass to which the decorative piece is to be attached. Next, a glue is applied to a backside of the decorative piece, the backside being fitted against an outer surface of the glassware, and the glue including a resin sensitive to ultraviolet (UV) light. Finally, the wine glass and decorative piece are radiated with an ultraviolet light having a defined wavelength for a predetermined period of time for the light to cure the resin and permanently affix the decorative piece to the wine glass.