The invention relates to a method of bonding together surfaces of two or more elements, whereby at least one of the two or more elements is a mineral wool element, said mineral wool element(s) being bound by a mineral wool binder, the method comprising the steps of providing two or more elements; applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other; curing the adhesive, wherein the adhesive comprises at least one protein; at least one phenol and/or quinone containing compound, and/or at least one enzyme.

The present disclosure relates to a metal thin film substrate including: a glass substrate; a pressure-sensitive adhesive layer formed on one surface of the glass substrate; and a metal layer formed on one surface of the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a silicone-based pressure-sensitive adhesive, a transparent display including the same, a method for patterning the metal thin film substrate, and a method for manufacturing the transparent display.

A protein adhesive of a novel sequence is disclosed. The protein adhesive according to the present disclosures enables adhesion between two non-biological materials or between a non-biological material and a biological material, thereby being applicable to various fields.

A manufacturing method for a bonded body of different materials includes a coating process of coating a surface of a base material of an inorganic material including metal or glass with a coupling agent solution, an irradiation process of forming a binding layer in which the base material and coupling agent molecules in the coupling agent solution are bonded through covalent bond by irradiating the surface of the base material coated with the coupling agent solution with a laser while a position of the laser is sequentially changed, a cleaning process of cleaning the coupling agent solution that is not covalently bonded to the base material, and a resin bonding process of bonding the binding layer and a resin.

The invention provides a fire-resistant glazing that is less susceptible to failure, a method of manufacturing a fire-resistant glazing, and the use of a fire-resistant glazing, the fire-resistant glazing including a glazing edge wherein at least one area of the glazing edge comprises a weakened primary sealant portion and/or a weakened secondary sealant portion.

A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

A pressure-sensitive adhesive film which is a pressure-sensitive adhesive film comprising a thermoplastic resin, wherein a maximum peak temperature of tan ? is 0? C. or more and 52? C. or less, a shear storage elastic modulus at 20? C. is 3?10.sup.5 Pa or more, and a proportion of an undissolved component in dissolution of 1.0 g of the pressure-sensitive adhesive film in 10 g of isopropyl alcohol is 35% by mass or more and 100% by mass or less.

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

A method of bonding together surfaces of two or more elements, whereby at least one of the two or more elements is a mineral wool element, said mineral wool element(s) being bound by a mineral wool binder, comprises the steps of providing two or more elements; applying an adhesive to one or more of the surfaces to be bonded together before, during or after contacting the surfaces to be bonded together with each other, curing the adhesive, wherein the adhesive comprises at least one protein; at least one phenol and/or quinone containing compound, and/or at least one enzyme.