The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

An electrical steel sheet adhesive coating composition according to an exemplary embodiment of the present invention includes, based on 100 wt % of the total solids: a resin at 20 to 40 wt % and having an average particle diameter of 10 to 300 nm; an inorganic nanoparticle at 10 to 35 wt % bonded with the resin; a metal phosphoric acid salt at 10 to 30 wt %; and phosphoric acid at 10 to 40 wt %. An electrical steel sheet product according to an exemplary embodiment of the present invention includes a plurality of electrical steel sheets; and an adhesive layer disposed between the plurality of electrical steel sheets, wherein the adhesive layer includes a metal of one or more kinds among Al, Mg, Ca, Co, Zn, Zr, and Fe at 0.5 to 30 wt %, N at 0.1 to 10 wt %, C at 0.1 to 5 wt %, P at 1 to 30 wt %, a metal of one or more kinds among Si and Ti at 10 to 30 wt %, and a balance of O.

Disclosed by embodiments of the present application are an optical adhesive tape and a display panel. The optical adhesive tape includes a first buffer layer and an opening disposed at a position corresponding to the fingerprint identification area and configured to penetrate the first buffer layer. The opening is filled with a removable filler including a second buffer layer.

Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator. Further disclosed are reactive adhesive film systems comprising two reactive adhesive films. Methods for producing reactive adhesive films, and methods are also disclosed.

A method of applying an adhesive film to a component includes applying an adhesive film to a surface of a component, wherein the adhesive film is positioned between the surface and an elastic membrane, the elastic membrane is transferred into a curved state with a convex and a concave side and contacted with the surface with the convex side first such that an adhesive layer of the adhesive film is pressed onto the surface in a full-area by the elastic membrane, the adhesive layer is pressed onto the surface in a full-area by a negative pressure being applied to that side of the elastic membrane facing towards the adhesive film, and to stabilize the component against deformation brought about by this negative pressure, the elastic membrane along with the adhesive film is pushed against the surface of the component with a plunger means.

Adhesion-promoting compositions containing organic titanates and/or organic zirconates and the use of the adhesion-promoting compositions to provide adhesion-promoting layers to enhance adhesion between metal substrates and an overlying free radical-polymerized sealant are disclosed.

A two-component epoxy resin composition, made of: a resin component including: at least one epoxy resin that contains on average more than one epoxy group per molecule; up to 25 wt.-% of at least one epoxy-functional reactive diluent having one or two epoxy groups per molecule; and a hardener component including: between 40 and 80 wt.-% of at least one amino-functional hardener of formula (I),

##STR00001##

wherein n is an integer with a value of 2 or 3, R.sup.1 is a linear, cyclic or branched alkyl residue that optionally contains ether oxygen atoms and R.sup.2 is a methyl or ethyl group; between 10 and 30 wt.-% of at least one Lewis base having at least one tertiary amino group, amidine group, or guanidine group; and between 10 and 30 wt.-% of at least one carboxylic acid.

To provide a bonding technique that is capable of bonding a metal and a resin with a sufficient bonding strength. A bonded article including a functional group-carrying metal surface and a functional group-carrying resin surface, which are bonded directly to each other, the functional group-carrying metal surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a metal, the functional group-carrying resin surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a resin.

Provided are a film including a matrix material, and a particle having an elastic modulus at 25° C. which is higher than an elastic modulus of the matrix material, in which the film has a region A at at least a part between the matrix material and the particle, and the region A contains a compound having a loss tangent of 0.1 or greater at 25° C.; and a laminate formed of the film.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.