An embodiment of the present invention provides an electrical steel sheet including: an upper adhesive layer positioned on an upper surface of an electrical steel sheet; and an lower adhesive layer positioned on a lower surface of the electrical steel sheet, wherein the upper adhesive layer has a pencil hardness of F or lower, and the lower adhesive layer has a pencil hardness of H or higher.

Embodiments of the disclosure relate to a blister package having a laminate structure that is heat-sealable to a lacquer layer on strain-hardened aluminum foil. The blister package includes a lid layer comprising a strain-hardened aluminum foil, a lacquer layer on a sealing surface of the strain-hardened aluminum foil and a laminate structure sealed directly to the lacquer layer. The laminate structure includes a multilayer film and a plurality of wells formed therethrough. The multilayer film includes a first formable layer of a thermoplastic material and a sealing layer of a copolyester material. The sealing layer overlies the first formable layer and has an outer surface opposite the first formable layer. The sealing layer has crystallinity from 5% to 20% as measured by differential scanning calorimetry (DSC). The outer surface of the sealing layer is sealed directly against the lacquer layer.

Provided herein is a pressure sensitive adhesive (PSA) comprising a polycrylate base polymer, a crosslinker and a fluorescer. The crosslinker does not comprise a metal acetylacetonate, a metal alkoxide, or an alkoxy-metal acetylacetonate, and the fluorescer comprises less than 0.1 wt. % metal oxide based on the solid weight of the adhesive. The adhesive is resistant to yellowing under adverse conditions such as high temperature treatment and/or exposure to UV.

An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.

Methods for processing a metal substrate for use in a power electronics device are provided. In one example, the method includes placing a metal substrate on a support associated with a laser system. The method includes performing a pulsed laser treatment process on at least a portion of the surface of the metal substrate. The pulsed laser treatment process exposes the at least a portion of the surface of the metal substrate to a plurality of laser pulses to modify a surface roughness of the at least a portion of the surface of the metal substrate. After performing the pulsed laser treatment process, the method includes creating a metallized interface for coupling an electrical component to the metal substrate at the at least a portion of the surface of the metal substrate.

The invention relates to a method for the production of a laminated core comprising a stack of metallic plates, in which: —a metallic sheet (2, 3) is chosen, having a first main face (4, 8) and a second main face (6, 9) which are coated with a sub-layer comprising at least one material selected from epoxides and polyepoxides, —a layer (12, 20) with a thickness of less than 500 μm of a precursor composition selected from partly epoxides and at least partly cross-linked polyepoxides is placed in contact with said sub-layer, —a layer (16, 22) with a thickness of less than 500 μm of a curing composition comprising at least one crosslinking agent is placed in contact with said sub-layer, —said metallic sheet is punched, —the metallic plates are then superposed to each other.

A device comprising an adhesive material and a fiberglass mesh located in direct planar contact with the adhesive material. The adhesive material is tacky in its green state and includes an epoxy, an epoxidized cashew nut shell oil, and at least about 20% by weight of a component containing a core shell polymer material to improve the adhesion capability to surfaces that are contaminated and/or exposed to high pressure spraying or chemical treatments, heat and humidity.

The present invention provides a damping material and a damping sheet made therefrom. Specifically, the present invention provides a damping material comprising 10-50 wt % of a block copolymer elastomer; 5-40 wt % of a specific-length fiber; 5-45 wt % of a thermoplastic non-elastomeric polymer; 5-50 wt % of a tackifier; 0-50 wt % of an inorganic filler; and 0-30 wt % of a flame retardant based on the total weight of the damping material. The damping material and the damping sheet made therefrom according to the present invention have high damping properties, a wide application temperature range and a low density, and can serve as a novel damping material in the current automobile, rail transit, construction and electrical appliance industries.

The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.

The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.