The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

A curable adhesive composition precursor comprising a first part (A) comprising: at least one diamine in an amount of from 10 to 50 wt.-% based on the total weight of part (A), at least one amine epoxy curing agent based on a phenolic lipid in an amount of from 10 to 50 wt.-% based on the total weight of part (A), and at least one inorganic filler material in an amount of from 10 to 60 wt.-% based on the total amount of part (A); and a second part (B) comprising: at least one first epoxy resin in an amount of from 15 to 60 wt.-% based on the total amount of part (B)), at least one viscosity modifier in an amount of from 1 to 25 wt.-%, based on the total weight of part (B), and at least one epoxy-reactive flexibilizer in an amount of from 0.1 to 10 wt.-% based on the total amount of part (B).

A temporary protective film including a support film and an adhesive layer provided on one surface or both surfaces of the support film. The support film is a polyimide film. The thickness of the adhesive layer is less than 8 μm.

A wiring member includes: a wire-like transmission member having a transmission wire body and a covering layer covering the transmission wire body; an adherend having an inorganic layer on a surface; and an adhesive agent intervening between the covering layer and the inorganic layer to be bonded to the covering layer and the inorganic layer, wherein the adhesive agent contains a chemical compound including at least one resin side functional group and at least one inorganic material side functional group in a molecular structure, the resin side functional group is chemically bonded to resin constituting the covering layer, and the inorganic material side functional group is chemically bonded to an inorganic material constituting the inorganic layer.

A preparation method for adhesive bonding of magnesium-containing aluminum alloy products includes a magnesium-containing aluminum alloy product including a matrix and a surface oxide layer overlying the matrix. The magnesium-containing aluminum alloy product also includes intermetallic particles at least proximal the surface oxide layer. The method also includes ablating at least some of the intermetallic particles via an energy source, and in the absence of melting of the matrix of the magnesium-containing aluminum alloy product.

The invention relates to a method for the production of a laminated core comprising a stack of metallic plates, in which: —a metallic sheet (2, 3) is chosen, having a first main face (4, 8) and a second main face (6, 9) which are coated with a sub-layer comprising at least one material selected from epoxides and polyepoxides, —a layer (12, 20) with a thickness of less than 500 μm of a precursor composition selected from partly epoxides and at least partly cross-linked polyepoxides is placed in contact with said sub-layer, —a layer (16, 22) with a thickness of less than 500 μm of a curing composition comprising at least one crosslinking agent is placed in contact with said sub-layer, —said metallic sheet is punched, —the metallic plates are then superposed to each other.

Adhesion-regulating agents for enhancing the adhesion values of acrylic adhesives, and methods of using adhesion-regulating agents for treating a removable flooring substrate surface for tuning the adhesion of the flooring substrate surface to objects comprising an acrylic adhesive are disclosed.

A method is provided for manufacturing an adhesively bonded structure including first and second components including first and second outer surfaces, respectively, at least the first component being a first metal component, the first and second outer surfaces facing one another and partially overlapping, and the adhesively bonded structure including an adhesive layer received between overlapping portions of the first and second outer surfaces. The method includes deforming the first outer surface of the first metal component along a first isolated path extending beside the first edge of the adhesive layer along at least a majority of a length of the first edge of the adhesive layer.

A method for analysing a bonding between two aeronautical parts. The method includes the steps of a) applying a release agent to a first surface to be bonded of a first part and to a second surface to be bonded of a second part, b) applying an adhesive to at least one of the first and second surfaces and positioning these surfaces on top of each other, the adhesive forming an adhesive film after polymerisation, c) separating the parts from each other and removing the adhesive film in one piece, d) analysing the adhesive film. The invention also relates to a method for bonding two aeronautical parts.

A method of bonding includes providing a thermoplastic substrate having a surface with a surface energy value of less than a 48 miliJoules per meter squared. The surface is exposed to particulate formed in a combustion flame from a precursor. The particulate forms an adherent layer of metal oxide on the surface. An adhesive is applied to the adherent layer. A second substance is placed in in simultaneous contact with the adhesive to bond the thermoplastic. A laminate is provided that includes a thermoplastic substrate having a surface. An adherent layer of metal oxide is on a surface of the thermoplastic substrate. An adhesive is attached to the adherent layer. A second substance is in simultaneous contact with the adhesive.