A protein adhesive of a novel sequence is disclosed. The protein adhesive according to the present disclosures enables adhesion between two non-biological materials or between a non-biological material and a biological material, thereby being applicable to various fields.

The present invention is to provide a method for producing a laminate having excellent adhesion properties. An embodiment of the present invention is a method for producing a laminate, the method including: a step 1 of dry-treating a surface A of a plastic to obtain a dry-treated plastic having a surface B that has been dry-treated; a step 2 of wiping the surface B with a cleaning tool containing a composition for wiping, the composition containing at least one solvent selected from the group consisting of water and polar solvents, and a silane coupling agent, to obtain a cleaned plastic having a surface C that has been wiped with the cleaning tool; and a step 3 of applying at least one selected from the group consisting of adhesives and primers on the surface C to obtain a laminated body.

Provided is a member surface treatment method for treating a surface of a member containing a crystallizable thermoplastic resin by a dry treatment, wherein the dry treatment is performed so as to satisfy the following conditions X and Y. Condition X: .sup.d/.sup.d0 is not less than 1.0 and less than 1.4. Condition Y: .sup.p/.sup.p0 is not less than 1.2 and less than 40. .sup.d0 is a non-polar component of surface free energy of the surface before the dry treatment, .sup.d is a non-polar component of surface free energy of the surface after the dry treatment, .sup.p0 is a polar component of surface free energy of the surface before the dry treatment, and .sup.p is a polar component of surface free energy of the surface after the dry treatment.

Adhesion-regulating agents for enhancing the adhesion values of acrylic adhesives, and methods of using adhesion-regulating agents for treating a removable flooring substrate surface for tuning the adhesion of the flooring substrate surface to objects comprising an acrylic adhesive are disclosed.

The present invention provides an adhered structure in which members of the same or different materials are adhered to each other with a high adhesive strength and a method for producing the adhered structure. The adhered structure of the present invention comprises a first solid member, a second solid member, and an adhesive member. The first solid member and the second solid member are adhered to each other through the adhesive member. The adhesive member contains a polymer. The polymer is chemically bonded to the first solid member and the second solid member.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

An adhesive film is used for a power storage device, wherein the power storage device includes a structure in which a power storage device element is accommodated in a package formed by a power storage device exterior material, the power storage device exterior material is composed of a laminate including at least a base material layer, a barrier layer, and thermally fusible resin layers in this order from the outside, the thermally fusible resin layers of the power storage device exterior material are thermally fused together to accommodate the power storage device element in the package, the adhesive film is used so as to be interposed between the thermally fusible resin layers at a position where the thermally fusible resin layers are thermally fused together, the adhesive film has a multilayer structure, and the adhesive film includes at least one resin layer L having a melting peak temperature of 100-135? C.

An adhesive film used for an electricity storage device, wherein the electricity storage device is accommodated in a package formed by an electricity storage device exterior material, the electricity storage device exterior material is constituted by at least a laminate including a base material layer, a barrier layer, and a heat-fusible resin layer from the outside, the electrical storage device element is accommodated in the package by heat fusing the heat-fusible resin layers of the electricity storage device exterior material to each other, the adhesive film is used by being interposed between the heat-fusible resin layers at a position where the heat-fusible resin layers are heat-fused to each other, and the adhesive film has a multilayer structure and includes at least one resin layer L having a melting peak temperature lower by 5? C. or more than that of the heat-fusible resin layers of the electricity storage device exterior material.