The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): ##STR00001##
wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): ##STR00002##
wherein Y is a bond, a C.sub.1-6 alkylene group, etc.; R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc., R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc., R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

A curing agent mixture is for coatings that cure at room temperature. The curing agent mixture can include (A) 10-60% by weight, preferably 20-60% by weight, more preferably 30-50% by weight, of a polysiloxane, (B) 40-90% by weight, preferably 40-80% by weight, more preferably 40-70% by weight, of an amino-functional alkoxysilane and (C) 1-10% by weight, preferably 2-7% by weight, more preferably 3-5% by weight, of a guanidine compound. The stated amounts of components (A), (B), and (C) add up to 100% by weight and are based on the curing agent mixture.

A single-component moisture-curable silicone composition including 100 parts by weight of at least one crosslinkable polydiorganosiloxane having silanol end groups, 5 to 20 parts by weight of at least one hydrophilic silica, 1 to 10 parts by weight of at least one organoalkoxysilane or organoalkoxysiloxane crosslinker that contains at least 2 alkoxysilane groups, 1 to 7 parts by weight of organoalkoxysilane or organoalkoxysiloxane that contains at least one aminoalkyl group having a primary amino group, 0.1 to 7 parts by weight of at least one tin catalyst, up to 5 parts by weight of organoalkoxysilane or organoalkoxysiloxane that contains at least two alkoxysilane groups, wherein silicone composition contains less than 1.0% by weight of water based on total composition, with proviso where reactivity in respect of hydrolysis of organoalkoxysilane or organoalkoxysiloxane is greater than reactivity in respect of hydrolysis of organoalkoxysilane or organoalkoxysiloxane crosslinker.

A method of sealing a service penetration in a structure, the method comprising applying a sealant composition around the service penetration on an exterior surface of the structure, wherein the penetration sealant composition comprises: from 5 to 40 wt % of a filler; from 20 to 80 wt % of a silicone polymer; and from 10 to 60 wt % of fire retardant compound.

The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I)
-A.sub.n-RSiXYZ(I),
wherein A is a divalent or trivalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C.sub.1 to C.sub.8 alkyl, C.sub.1 to C.sub.8 alkoxy, C.sub.1 to C.sub.8 acyloxy groups and CH.sub.2NR wherein N is oxygen, nitrogen or sulfur, preferably oxygen, and R is selected from C.sub.1 to C.sub.8 alkyl groups, preferably a methyl group, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C.sub.1 to C.sub.8 alkoxy or C.sub.1 to C.sub.8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II) ##STR00001## wherein R.sup.1 is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, R.sup.2 is same or different and is, independently from one another, selected from hydrocarbon residues having 1 to 12 carbon atoms, Ar is selected from aryl groups, and n is an integer selected from 3 to 9; and adhesive, sealant, or coating materials comprising the composition and use thereof.

The invention relates to curable polyorganosiloxanes with special silicon-containing terminal groups and curable compositions based on these polyorganosiloxanes, a capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the use thereof.

The invention relates to curable compositions based on curable polymers containing a special capped adhesion promoter, and optionally a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the uses thereof.

The invention relates to curable compositions based on polyorganosiloxanes with special silicon-containing terminal groups, a special capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention furthermore relates to the use thereof.

The invention provides a novel polymer, a composition, and a molded article. The polymer contains a constitutional unit represented by the following formula (1): ##STR00001##
wherein X.sup.11 and X.sup.12 are the same as or different from each other, and are each a hydrogen atom, an alkyl group optionally containing a fluorine atom, or a phenyl group; Y.sup.11 is an oxygen atom or a sulfur atom; Rf.sup.11 is a hydrogen atom or an alkyl group optionally containing a fluorine atom; and a is an integer of 1 to 4.