The present invention provides a film and/or a packaging bag from which contents that may be viscous are easily brought out, and exhibiting enough heat seal properties as well as superior anti-blocking effect and slipperiness. The sealant film has a seal layer consisting of a resin composition including the following (a) and (b), and the film satisfies the following (1) to (3). (a) Polyolefin-based resin; and (b) Silylated polyolefin resin, (1) An abundance ratio (Si/C) of silicon atoms Si to carbon atoms C included in the seal layer of 0.001 or more and 0.02 or less; (2) An abundance ratio (Si/C) of silicon atoms Si to carbon atoms C present at a surface of the seal layer of 0.05 or more and 0.2 or less; and (3) An arithmetic average roughness Ra of a surface of the seal layer of 0.07 m or more and 0.5 m or less.

Described is a method for the production of a moisture curable composition whereby the reactive end groups of a reactive polymer are reacted with a cross-linking agent for forming a prepolymer, whereby the method is operated in batch mode and the production of the prepolymer occurs in a mixing vessel, characterized in that the reactive polymer and the cross-linking agent, as well as the additional ingredients necessary for the production step in the mixing vessel, are introduced into the closed mixing vessel and react without opening the mixing vessel, and the mixing takes place without opening the mixing vessel, and the product is removed from the mixing vessel without opening the mixing vessel.

Provided is a novel polyoxyalkylene compound which contains, at a molecular chain terminal, at least one reactive silicon-containing group represented by formula (1) per molecule and which has a main chain that is a polyoxyalkylene polymer. Also provided are: a process for producing the novel polyoxyalkylene compound; a room-temperature-curable composition which includes the compound as a main component and can contain any of various crosslinking agents; a sealing material; and an article. ##STR00001##
(In formula (1), R.sup.1 and R.sup.2 are each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond).

A sealant material for sealing threaded pipe joints that is a multifilament or spun polyphenylene sulfide yarn and a joint sealing composition comprising a silicone oil or a natural oil with a smoke point of about 230 C. or higher. The polyphenylene sulfide yarn is coated with the joint sealant composition. The material forms an effective seal and is resistant even when used in systems in which it is exposed to temperatures in excess of 280 C. The material may be provided in a dispenser.

The present invention provides: a room temperature curable organopolysiloxane composition which has curability equivalent to the curability of conventional dealcoholization type or deoximation type room temperature curable organopolysiloxane compositions even if various catalysts are used therefor, while reducing harmful effects on human bodies and burden on the environment, and which enables the achievement of a cured product that has good rubber properties, adhesiveness and durability if cured; various articles which comprise this composition or a cured product that is obtained by curing this composition; a novel hydrolyzable organosilane compound which is useful as a curing agent for this composition; and a method for producing this novel hydrolyzable organosilane compound. A room temperature curable organopolysiloxane composition which contains, as a curing agent, a hydrolyzable organosilane compound that is represented by general formula (2) and releases/discharges a cyclic ketone compound as a leaving group and/or a partial hydrolysis-condensation product of the hydrolyzable organosilane compound.

##STR00001##

(In the formula, R.sup.2 represents a monovalent hydrocarbon group having from 1 to 10 carbon atoms; n represents a number from 1 to 8; and m represents 3 or 4.)

There is provided a case of an electric apparatus and the manufacturing method therefor in which a sealing material, the portion of which at the depth is cured without being heated, is utilized at the junction portion of two or more case members. The case of the electric apparatus has a gap forming portion that form a gap in a junction portion where two or more case members for containing an electric apparatus are joined to each other and a sealing material filled into the gap between the gap forming portion; the sealing material is a two-liquid-mixed addition-reaction-curable sealing material that has a normal-temperature curability and includes a platinum catalyst.

Provided is a curable organopolysiloxane composition from which highly heat-resistant cured products can be obtained, the curable organopolysiloxane composition comprising: (A) 100 parts by mass of a novel organopolysiloxane represented by formula (1) ##STR00001##
(R.sup.1 is an alkyl group or an alkoxy substituted alkyl group having 1 to 6 carbon atoms, R.sup.2 is a group selected from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and a group in which a portion of the hydrogen atoms of those groups is substituted with a halogen atom, Ar is an arylene group having 6 carbon atoms or more, a is 1 to 1,000, b is 1 to 5,000, and n is 1 to 3, the total of n in an unsubstituted or substituted alkoxysilyl group on both ends of the molecular chain being 3 or more); and (B) 0.01 to 10 parts by mass of a curing catalyst. Also provided are electrical and electronic components, a vehicle oil seal, a building sealant, etc. which use the cured product of the composition.

A conversion product which has at least one aliphatic amidine or guanidine group and at least one polysiloxane radical, and the use of the conversion product as a catalyst for cross-linking hardenable compositions, in particular based on polymers containing silane groups. The conversion product is largely odor-free, non-volatile, and of low toxicity. The conversion product accelerates the cross-linking of such compositions surprisingly well, does not impair the stability of such compositions in storage, and is very highly compatible, which means that such compositions do not tend toward separation or migration or evaporation of the catalyst.

The present invention has an object to provide a photocurable resin composition which can be quickly cured by irradiation with active energy rays such as ultraviolet rays and achieves excellent adhesion to an electrolyte membrane having properties difficult to bond. Specifically, provided is a photocurable resin composition containing the following (A) to (C) ingredients: (A) ingredient: a polymer having a polyisobutylene backbone containing a [CH.sub.2C(CH.sub.3).sub.2] unit, the polymer having one or more (meth)acryloyl groups; (B) ingredient: a photo-radical polymerization initiator; and (C) ingredient: one or more compounds selected from the group consisting of silicone oligomers each having one or more alkoxy groups and one or more (meth)acryloyl groups, silicone oligomers each having one or more alkoxy groups and one or more amino groups, and silane compounds each having one or more isocyanate groups.

A two part curable composition comprising organosiloxane polymer; water; an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; crosslinker; adhesion promoter and catalyst; and optionally comprising plasticizer; colorant and filler. The first part can comprise organosiloxane polymer and water. The second part can comprise crosslinker; adhesion promoter and catalyst. Either or both parts can optionally further comprise an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; plasticizer; colorant and filler. Cured reaction products of the two part curable organosiloxane composition has good adhesion to metallic sealing surfaces and good resistance engine oil and other automotive fluids. Cured reaction products of the two part curable organosiloxane composition can surprisingly retain physical properties after long-term exposure to temperatures between 200 C. and 250 C. and can retain physical properties after exposure to temperatures between 250 C. to 300 C. for short periods.