There is provided a super-abrasive grain including: a body composed of cubic boron nitride or diamond; and a ceramic coating film coating at least a portion of a surface of the body.

Present invention provides Chemical Mechanical Planarization Polishing (CMP) compositions for Shallow Trench Isolation (STI) applications. The CMP compositions contain ceria coated inorganic oxide particles as abrasives, such as ceria-coated silica particles; chemical additive selected from the group consisting of an organic acetylene molecule containing an acetylene bond and at least two or multi ethoxylate functional groups with terminal hydroxyl groups, an organic molecule with at least two or multi hydroxyl functional groups in the same molecule, and combinations thereof; water soluble solvent; and optionally biocide and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.

Chemical Mechanical Planarization (CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer low dishing, low defects, and high removal rate for polishing oxide films. Chemical Mechanical Planarization (CMP) polishing compositions have shown excellent performance using soft polishing pad.

A cubic boron nitride particle population having highly-etched surfaces and a high toughness index is produced by blending a reactive metal powder with a plurality of cubic boron nitride particles to form a blended mixture. The blended mixture is compressed to form a compressed mixture. The compressed mixture is subjected to a temperature and a pressure, where the temperature is controlled to cause etching of the plurality of cubic boron nitride particles by reaction of cubic boron nitride with the reactive metal powder, thereby forming a plurality of etched cubic boron nitride particles. Also, the temperature and pressure are controlled to cause boron nitride to remain in a cubic boron nitride phase. Afterwards, the plurality of etched cubic boron nitride particles is recovered from the compressed mixture to form the particle population. Preferably, the particle population contains no hexagonal boron nitride.

An abrasive article is provided that may include a body. The body may include a bond component and abrasive particles within the bond component. The bond component may include a FeCoCuNiSn based bond material and a performance enhancing material. The performance enhancing material may include hex-boron nitride. The content of the performance enhancing material may be at least about 6 vol. % and not greater than about 14 vol. % for a total volume of the bond component.

Magnetizable abrasive particles are described comprising ceramic particles having outer surfaces comprising a coating of unsintered polyion and magnetic particles bonded to the polyion. In favored embodiments, the magnetic particles have a magnetic saturation of at least 10, 15, 20, 25, 30, 35, 40, 45 or 50 emu/gram. In another embodiment, an abrasive article is described comprising a plurality of magnetizable abrasive particles as described herein retained in a binder material. Also described are method of making magnetizable abrasive particles and methods of making an abrasive article comprising magnetizable abrasive particles.

Various embodiments disclosed relate to an abrasive article. The abrasive article includes a metallic matrix component, an abrasive particle component dispersed within the metallic matrix component; and a filler particle component dispersed within the metallic matrix component. A portion of the filler particle component is at least partially coated by a first metallic layer. Additionally, a hardness of the abrasive particle component is greater than a hardness of the filler particle component

Disclosed is a composite abrasive with hard core and soft shell, comprising hard abrasive core with grain diameter in a range of 0.11 m and a soft oxide shell with thickness in a range of 5100 nm, the grain size of the oxide of the soft oxide shell is in a range of 520 nm, the composite abrasive is obtained from aqueous solution of oxide inorganic salt precursor and the hard abrasive by dispersing, constant temperature reflux hydrolyzing, solid-liquid separating, washing and drying. The component abrasive with hard core and soft shell of the present invention can improve the manufacturing efficiency and the surface quality during the ultraprecise manufacturing of the sapphire substrate.

This invention pertains to slurries, methods and systems that can be used in chemical mechanical planarization (CMP) of tungsten containing semiconductor device. Additives are used to reduce the dishing on large and small feature sizes (large bond pad as well as fine line structures) without retarding the tungsten removal rate.

In one aspect, the present disclosure provides cerium oxide'abrasive grains that can improve the polishing rate.

One aspect of the present disclosure relates to cerium oxide abrasive grains for use in an abrasive, in which an amount of water production in a temperature range of 300 C. or less measured using temperature-programmed reaction is 8 mmol/m.sup.2 or more per unit surface area of the cerium oxide abrasive grains.