A method of storing and/or transporting oxo alcohol, comprises: combining an oxo alcohol having an initial aldehyde content X and an initial peroxide content Y with 5 ppm to 100 ppm of a phenolic antioxidant, preferably a phenolic antioxidant without ester linkage groups; and storing and/or transporting the oxo alcohol. The oxo alcohol can be used to produce a plasticizer, e.g., without adversely affecting color.

A method of storing and/or transporting oxo alcohol, comprises: combining an oxo alcohol having an initial aldehyde content X and an initial peroxide content Y with 5 ppm to 100 ppm of a phenolic antioxidant, preferably a phenolic antioxidant without ester linkage groups; and storing and/or transporting the oxo alcohol. The oxo alcohol can be used to produce a plasticizer, e.g., without adversely affecting color.

The present invention concerns a stabilising antioxidative composition comprising tris(2-t-butylphenyl) phosphite in the absence of tris(2,4-di-t-butylphenyl) phosphite.

The present invention concerns a stabilising antioxidative composition comprising tris(2-t-butylphenyl) phosphite in the absence of tris(2,4-di-t-butylphenyl) phosphite.

Provided are a liquid epoxy resin sealing material capable of suppressing occurrence of fillet cracks generated when an underfill cured product is left under high temperature aerobic conditions, and a semiconductor device using the liquid epoxy resin sealing material. More specifically, provided are the liquid epoxy resin sealing material containing (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler and (D) an antioxidant agent represented by the following formula, wherein 0.5 to 10 parts by mass of (D) the antioxidant agent is contained based on a total of 100 parts by mass of (A) the epoxy resin and (B) the amine curing agent, and the semiconductor device using the liquid epoxy resin sealing material.

Provided are a liquid epoxy resin sealing material capable of suppressing occurrence of fillet cracks generated when an underfill cured product is left under high temperature aerobic conditions, and a semiconductor device using the liquid epoxy resin sealing material. More specifically, provided are the liquid epoxy resin sealing material containing (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler and (D) an antioxidant agent represented by the following formula, wherein 0.5 to 10 parts by mass of (D) the antioxidant agent is contained based on a total of 100 parts by mass of (A) the epoxy resin and (B) the amine curing agent, and the semiconductor device using the liquid epoxy resin sealing material.

Provided are: a stabilizer composition capable of imparting a vinyl chloride resin with excellent thermal stability, coloration resistance, and thermal coloration resistance; a vinyl chloride resin composition containing the same and a molded article of the composition. The stabilizer composition contains, with respect to 100 parts by mass of a component (A): 5 to 700 parts by mass of a component (B) and 5 to 200 parts by mass of a component (C). The component (A) is at least one organic acid zinc salt, the component (B) is at least one selected from the group consisting of organic acid barium salts, overbased barium carbonates, organic acid calcium salts and overbased calcium carbonates, and the component (C) is at least one hindered amine-based light stabilizer.

Provided are: a stabilizer composition capable of imparting a vinyl chloride resin with excellent thermal stability, coloration resistance, and thermal coloration resistance; a vinyl chloride resin composition containing the same and a molded article of the composition. The stabilizer composition contains, with respect to 100 parts by mass of a component (A): 5 to 700 parts by mass of a component (B) and 5 to 200 parts by mass of a component (C). The component (A) is at least one organic acid zinc salt, the component (B) is at least one selected from the group consisting of organic acid barium salts, overbased barium carbonates, organic acid calcium salts and overbased calcium carbonates, and the component (C) is at least one hindered amine-based light stabilizer.

The present invention relates to stabilizers for thiol-ene compositions and to radiation curable thiol-ene compositions based thereon. Such radiation curable compositions can advantageously be used in inks, overprint varnishes, coatings, adhesives, for the making of 3D objects and for the making of solder resist and gel nails. Provided in particular is an inhibitor system (I) for thiol-ene compositions based on —at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, —at least one acidic compound (ii) having a pKa between 1 and 3, and —at least one compound (iii) selected from the group consisting of phosphites and phosphonites, with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring. Also provided is an inhibitor system (II) for thiol-ene compositions based on that is based on —at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, —at least one compound (iv) selected from the group consisting of spirophosphites, and —optionally, at least one acidic compound (ii) having a pKa between 1 and 3, and with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring.

The present invention relates to stabilizers for thiol-ene compositions and to radiation curable thiol-ene compositions based thereon. Such radiation curable compositions can advantageously be used in inks, overprint varnishes, coatings, adhesives, for the making of 3D objects and for the making of solder resist and gel nails. Provided in particular is an inhibitor system (I) for thiol-ene compositions based on —at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, —at least one acidic compound (ii) having a pKa between 1 and 3, and —at least one compound (iii) selected from the group consisting of phosphites and phosphonites, with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring. Also provided is an inhibitor system (II) for thiol-ene compositions based on that is based on —at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, —at least one compound (iv) selected from the group consisting of spirophosphites, and —optionally, at least one acidic compound (ii) having a pKa between 1 and 3, and with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring.