The present invention relates to stabilizers for thiol-ene compositions and to radiation curable thiol-ene compositions based thereon. Such radiation curable compositions can advantageously be used in inks, overprint varnishes, coatings, adhesives, for the making of 3D objects and for the making of solder resist and gel nails. Provided in particular is an inhibitor system (I) for thiol-ene compositions based onat least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, at least one acidic compound (ii) having a pKa between 1 and 3, andat least one compound (iii) selected from the group consisting of phosphites and phosphonites, with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring. Also provided is an inhibitor system (II) for thiol-ene compositions based on that is based onat least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, at least one compound (iv) selected from the group consisting of spirophosphites, andoptionally, at least one acidic compound (ii) having a pKa between 1 and 3, and with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring.

The present invention relates to stabilizers for thiol-ene compositions and to radiation curable thiol-ene compositions based thereon. Such radiation curable compositions can advantageously be used in inks, overprint varnishes, coatings, adhesives, for the making of 3D objects and for the making of solder resist and gel nails. Provided in particular is an inhibitor system (I) for thiol-ene compositions based on at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, at least one acidic compound (ii) having a pKa between 1 and 3, and at least one compound (iii) selected from the group consisting of phosphites and phosphonites, with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring. Also provided is an inhibitor system (II) for thiol-ene compositions based on that is based on at least one inhibitor compound (i) having a % DPPH radical scavenging activity of at least 90%, the inhibitor compound (i) being selected from substituted benzene compounds or substituted naphthalene compounds containing at least two substituents selected from the group consisting of hydroxyl groups and C1-C3 alkoxy groups bonded directly to the benzene or the naphthalene ring, at least one compound (iv) selected from the group consisting of spirophosphites, and optionally, at least one acidic compound (ii) having a pKa between 1 and 3, and with the proviso that if the inhibitor compound (i) is a substituted benzene that it contains at least two hydroxyl groups bonded directly to the benzene ring.

The present invention relates to the use of phosphorous-containing organic oxyimides according to the general formula (I) as flame retardant for plastic materials, as radical generators in plastic materials and/or stabilisers for plastics. In addition, the present invention relates to a flame-retardant plastic material moulding compound in which the previously described phosphorous-containing organic oxyimides are integrated, and also to a method for the production of the previously mentioned plastic material composition. Furthermore, the present invention relates to a moulded article, a paint or a coating from the previously mentioned flame-retardant plastic material composition.

Disclosed herein is a stabilizer mixture for modifying an olefin-based polymer, which comprises at least one organic phosphorus-containing antioxidant represented by a formula selected from the group consisting of formulae (1), (2), (3), (4), (5), (6), (7), and (8), as well as at least one sulfur-containing carboxylate salt represented by a formula selected from the group consisting of formulae (9), (10), (11), and (12). Also disclosed herein is a modified polymer composition prepared from an olefin-based polymer using the stabilizer mixture. The olefin-based polymer is selected from the group consisting of polyolefin, ethylene-vinyl acetate copolymer, and a combination thereof.

The present invention addresses the problem of providing a decomposition inhibitor for inhibiting the decomposition of hydrogen peroxide included in an etching liquid composition for titanium nitride. The present invention relates to a decomposition inhibitor that is used to inhibit the decomposition of hydrogen peroxide included in an etching liquid composition for titanium nitride and that includes at least one compound selected from among azole compounds, aminocarboxylic acid compounds, and phosphonic acid compounds as an active component.

A method of storing an antioxidant mixture includes storing an antioxidant mixture containing an antioxidant and an aluminum compound represented by the following formula (3): AlR.sub.3 (3) wherein R moieties each independently represent a halogen atom or an alkyl group having 3 or more carbon atoms.

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula I-P, I-O or I-M. Further embodiments are a compound of formula I-P, I-O or I-M, a process for protection of the organic material by the compound, the use of the compound against degradation of the organic material, an additive composition comprising the compound, a process for manufacturing the compound and an intermediate involved therein. ##STR00001##

Disclosed herein is a stabilizer mixture for modifying an olefin-based polymer, which comprises at least one organic phosphorus-containing antioxidant represented by a formula selected from the group consisting of formulae (1), (2), (3), (4), (5), (6), (7), and (8), as well as at least one sulfur-containing carboxylate salt represented by a formula selected from the group consisting of formulae (9), (10), (11), and (12). Also disclosed herein is a modified polymer composition prepared from an olefin-based polymer using the stabilizer mixture. The olefin-based polymer is selected from the group consisting of polyolefin, ethylene-vinyl acetate copolymer, and a combination thereof.

The present invention relates to the use of phosphorus-containing organic oxyimides according to the general formula I described below as flame retardant for plastic materials, as radical generators in plastic materials and/or as stabilisers for plastic materials. The present invention relates in addition to a flame-retardant plastic material moulding compound in which the previously described phosphorus-containing organic oxyimides are integrated, and also to a method for the production of the previously mentioned plastic material composition. Furthermore, the present invention relates to a moulded part, a paint or a coating made of the previously mentioned flame-retardant plastic material composition.

Disclosed is an antioxidant for a thermoplastic resin that provides an excellent oxidation-preventing effect to a thermoplastic resin and that has an excellent effect of preventing a change in color caused by nitrogen oxides. Specifically, a compound represented by any of General Formulae (2) to (4), particularly a compound in which R.sup.2 in the formulae is an alkyl group having 1 to 8 carbon atoms whose terminal on an oxygen atom side is linked with COO, is used as the antioxidant for a thermoplastic resin. Details of General Formulae (2) to (4) are as described in the description.